Inventor · disambiguated record
Chu-Chun Hsieh
Also filed as: HSIEH CHU-CHUN
4 granted patents·2 pending applications·7 citations·filing 2018–2024
64Inventor score
Files withWINBOND ELECTRONICS CORP6
Top patents by PatentIndex Score
6 records- 0189US10840382B2Non-volatile memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 17, 2020·3 cites·14 claims
- 0283US10720533B2Non-volatile memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Jul 21, 2020·4 cites·6 claims
- 0360US12438004B2Method for forming semiconductor device that includes flash memoryWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 0455US2025311309A1Flash memory device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0548US12106964B2Double-patterning method to improve sidewall uniformityWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 1, 2024·0 cites·8 claims
- 0648US2024222191A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →