Inventor · disambiguated record
Sheng-Yu Wu
Also filed as: WU SHENG-YU
55 granted patents·3 pending applications·213 citations·filing 2005–2023
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD36TAIWAN SEMICONDUCTOR MFG7KUO TIN-HAO2WU SHENG-YU2ADVANCED SEMICONDUCTOR ENG1
Top patents by PatentIndex Score
58 records- 0196US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 0294US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 0394US9287234B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·10 cites·20 claims
- 0492US9190348B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·9 cites·20 claims
- 0591US9871013B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 16, 2018·10 cites·20 claims
- 0691US9496233B2Interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 15, 2016·7 cites·20 claims
- 0790US11239305B2Display device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·2 cites·20 claims
- 0890US10290600B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 0990US10157874B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·6 cites·20 claims
- 1090US10056345B2Conical-shaped or tier-shaped pillar connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 21, 2018·5 cites·20 claims
- 1190US7256066B2Flip chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 14, 2007·19 cites·4 claims
- 1288US10163844B2Semiconductor device having conductive bumps of varying heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·5 cites·20 claims
- 1387US8912649B2Dummy flip chip bumps for reducing stressWU SHENG-YU·Filed 2011·Granted Dec 16, 2014·7 cites·16 claims
- 1486US9711477B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·3 cites·20 claims
- 1585US9646943B1Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 9, 2017·3 cites·20 claims
- 1685US9269688B2Bump-on-trace design for enlarge bump-to-trace distanceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·4 cites·20 claims
- 1781US9583367B2Methods and apparatus for bump-on-trace chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·3 cites·20 claims
- 1881US8598691B2Semiconductor devices and methods of manufacturing and packaging thereofWU SHENG-YU·Filed 2011·Granted Dec 3, 2013·6 cites·20 claims
- 1980US10504856B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 10, 2019·2 cites·20 claims
- 2079US9484317B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·2 cites·20 claims
- 2178US2023253358A1Bump-on-Trace Design for Enlarge Bump-to-Trace DistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2277US11961810B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2377US8922006B2Elongated bumps in integrated circuit devicesLIN YEN-LIANG·Filed 2012·Granted Dec 30, 2014·5 cites·18 claims
- 2476US8643196B2Structure and method for bump to landing trace ratioYU CHEN-HUA·Filed 2012·Granted Feb 4, 2014·3 cites·20 claims
- 2574US11812646B2Display device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 2673US9559069B2Semiconductor device, integrated circuit structure using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 31, 2017·2 cites·20 claims
- 2772US11824026B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·20 claims
- 2872US9679862B2Semiconductor device having conductive bumps of varying heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·2 cites·20 claims
- 2972US9093332B2Elongated bump structure for semiconductor devicesKUO TIN-HAO·Filed 2011·Granted Jul 28, 2015·3 cites·20 claims
- 3071US11177228B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·1 cites·20 claims
- 3171US9165796B2Methods and apparatus for bump-on-trace chip packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 3270US11908818B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3370US9935073B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 3, 2018·1 cites·20 claims
- 3468US8823170B2Apparatus and method for three dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 2, 2014·2 cites·20 claims
- 3568USD627740SEject mechanismHON HAI PREC IND CO LTD·Filed 2010·Granted Nov 23, 2010·15 cites·1 claims
- 3667US11043462B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 3765US11658143B2Bump-on-trace design for enlarge bump-to-trace distanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 23, 2023·0 cites·20 claims
- 3865US11152273B2Conductive structures and redistribution circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 3965US9633965B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·1 cites·20 claims
- 4065US8981576B2Structure and method for bump to landing trace ratioTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 17, 2015·1 cites·20 claims
- 4164US10985114B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 4264US10734347B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 4363US10861811B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 4461US10319691B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
- 4558US11315896B2Conical-shaped or tier-shaped pillar connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·20 claims
- 4658US10515919B2Bump-on-trace design for enlarge bump-to-trace distanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·20 claims
- 4758US10388620B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·0 cites·19 claims
- 4857US2025214776A1Picking method, picking vehicle and picking systemIND TECH RES INST·Filed 2023·Application pending·0 cites
- 4956US10629509B2Redistribution circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 5055US10319695B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →