Inventor · disambiguated record
Masato Yoshiya
Also filed as: YOSHIYA MASATO
2 granted patents·4 pending applications·4 citations·filing 2005–2011
50Inventor score
Top patents by PatentIndex Score
6 records- 0171US7614293B2Method of evaluating adhesion property, low-adhesion material, and mold for molding resinTOWA CORP·Filed 2005·Granted Nov 10, 2009·2 cites·1 claims
- 0269US7784764B2Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing materialTOWA CORP·Filed 2005·Granted Aug 31, 2010·2 cites·11 claims
- 0360US2010012816A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2009·Application pending·0 cites
- 0454US2012076886A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2011·Application pending·0 cites
- 0552US2011042857A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2010·Application pending·0 cites
- 0642US2008296532A1Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialKUNO TAKAKI·Filed 2006·Application pending·0 cites
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