Inventor · disambiguated record
Kouichi Nagao
Also filed as: NAGAO KOUICHI
11 granted patents·2 pending applications·158 citations·filing 1981–2011
90Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD4PANASONIC CORP4HITACHI CHEMICAL CO LTD2HITACHI CHEMICAL COMPANY INC1SHIMOISHIZAKA NOZOMI1
Top patents by PatentIndex Score
13 records- 0191US7250575B2Wiring board, semiconductor device and display moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 31, 2007·27 cites·11 claims
- 0282US7582968B2Wiring board with a protective film greater in heights than bumpsPANASONIC CORP·Filed 2006·Granted Sep 1, 2009·11 cites·6 claims
- 0378US7514802B2Wiring boardPANASONIC CORP·Filed 2006·Granted Apr 7, 2009·9 cites·16 claims
- 0476US5234522AMethod of producing flexible printed-circuit board covered with coverlayHITACHI CHEMICAL COMPANY INC·Filed 1991·Granted Aug 10, 1993·38 cites·22 claims
- 0573US7442074B2Wiring board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Oct 28, 2008·6 cites·8 claims
- 0666US7800913B2Wiring board and semiconductor device using the samePANASONIC CORP·Filed 2006·Granted Sep 21, 2010·4 cites·8 claims
- 0764US5526563AMethod for manufacturing an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 18, 1996·26 cites·18 claims
- 0846US2009154126A1Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2008·Application pending·0 cites
- 0944US5089346AHeat resistant adhesive composition and bonding method using the sameHITACHI CHEMICAL CO LTD·Filed 1990·Granted Feb 18, 1992·17 cites·17 claims
- 1044US4389854AHigh speed freezing system for a refrigeratorTOKYO SHIBAURA ELECTRIC CO·Filed 1981·Granted Jun 28, 1983·16 cites·13 claims
- 1142US2006267219A1Wiring board and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1233US8283775B2Wiring board, semiconductor device and method for manufacturing the sameSHIMOISHIZAKA NOZOMI·Filed 2011·Granted Oct 9, 2012·0 cites·9 claims
- 1331US5171826AHeat resistant adhesive composition and bonding method using the sameHITACHI CHEMICAL CO LTD·Filed 1991·Granted Dec 15, 1992·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →