Inventor · disambiguated record
Sidharth Dalmia
Also filed as: DALMIA SIDHARTH · DALMIA SIDHARTH S
55 granted patents·17 pending applications·726 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
72 records- 0197US11955732B2Wireless communication technology, apparatuses, and methodsINTEL CORP·Filed 2022·Granted Apr 9, 2024·7 cites·23 claims
- 0297US11424539B2Wireless communication technology, apparatuses, and methodsINTEL CORP·Filed 2017·Granted Aug 23, 2022·71 cites·6 claims
- 0397US7795995B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2005·Granted Sep 14, 2010·62 cites·33 claims
- 0496US11011827B2Antenna boards and communication devicesINTEL IP CORP·Filed 2018·Granted May 18, 2021·17 cites·25 claims
- 0596US8013688B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2010·Granted Sep 6, 2011·24 cites·22 claims
- 0696US7068124B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2005·Granted Jun 27, 2006·39 cites·32 claims
- 0795US10741932B2Compact radio frequency (RF) communication modules with endfire and broadside antennasINTEL IP CORP·Filed 2018·Granted Aug 11, 2020·28 cites·25 claims
- 0895US10049961B1Partially molded direct chip attach package structures for connectivity module solutionsINTEL IP CORP·Filed 2017·Granted Aug 14, 2018·13 cites·24 claims
- 0994US6900708B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2003·Granted May 31, 2005·79 cites·34 claims
- 1093US11937367B2Radio frequency front-end structuresINTEL CORP·Filed 2023·Granted Mar 19, 2024·2 cites·20 claims
- 1193US11664596B2Antenna modules and communication devicesINTEL CORP·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 1293US10797394B2Antenna modules and communication devicesINTEL CORP·Filed 2018·Granted Oct 6, 2020·8 cites·25 claims
- 1393US10566298B2Package on antenna packageINTEL CORP·Filed 2016·Granted Feb 18, 2020·20 cites·20 claims
- 1493US7489914B2Multi-band RF transceiver with passive reuse in organic substratesGEORGIA TECH RES INST·Filed 2005·Granted Feb 10, 2009·48 cites·20 claims
- 1592US12068525B2Integrated circuit packages, antenna modules, and communication devicesINTEL CORP·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 1692US11380979B2Antenna modules and communication devicesINTEL IP CORP·Filed 2018·Granted Jul 5, 2022·8 cites·25 claims
- 1792US10756033B2Wireless module with antenna package and cap packageINTEL IP CORP·Filed 2016·Granted Aug 25, 2020·9 cites·20 claims
- 1892US10186756B2Antennas in electronic devicesINTEL IP CORP·Filed 2016·Granted Jan 22, 2019·8 cites·19 claims
- 1992US8345433B2Heterogeneous organic laminate stack ups for high frequency applicationsAVX CORP·Filed 2005·Granted Jan 1, 2013·25 cites·8 claims
- 2092US8203418B2Manufacture and use of planar embedded magnetics as discrete components and in integrated connectorsHARRISON WILLIAM LEE·Filed 2009·Granted Jun 19, 2012·51 cites·38 claims
- 2191US8466769B2Planar inductor devicesDALMIA SIDHARTH·Filed 2011·Granted Jun 18, 2013·14 cites·18 claims
- 2290US11670435B2Hybrid cabling solution for higher bandwidth and millimeter wave applicationsAPPLE INC·Filed 2021·Granted Jun 6, 2023·2 cites·15 claims
- 2390US6987307B2Stand-alone organic-based passive devicesGEORGIA TECH RES INST·Filed 2003·Granted Jan 17, 2006·58 cites·9 claims
- 2489US7808434B2Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devicesAVX CORP·Filed 2007·Granted Oct 5, 2010·18 cites·21 claims
- 2589US7260890B2Methods for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2003·Granted Aug 28, 2007·35 cites·19 claims
- 2688US9113570B2Planar electronic device having a magnetic componentTYCO ELECTRONICS SERVICES GMBH·Filed 2012·Granted Aug 18, 2015·10 cites·13 claims
- 2787US7989895B2Integration using package stacking with multi-layer organic substratesAVX CORP·Filed 2007·Granted Aug 2, 2011·15 cites·11 claims
- 2886US2025316887A1Antenna modules and communication devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 2985US11509037B2Integrated circuit packages, antenna modules, and communication devicesINTEL CORP·Filed 2018·Granted Nov 22, 2022·3 cites·20 claims
- 3085US7805834B2Method for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2007·Granted Oct 5, 2010·10 cites·20 claims
- 3184US9201104B2Intelligent power sensing deviceTYCO ELECTRONICS CORP·Filed 2012·Granted Dec 1, 2015·6 cites·9 claims
- 3283US12255382B2Antenna modules and communication devicesINTEL CORP·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 3381US12200855B2Radio frequency front-end structuresINTEL CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 3481US11121468B2Antenna modules and communication devicesINTEL CORP·Filed 2020·Granted Sep 14, 2021·1 cites·20 claims
- 3581US8823480B2Planar electronic deviceDALMIA SIDHARTH·Filed 2012·Granted Sep 2, 2014·8 cites·12 claims
- 3680US2025071885A1Radio frequency front-end structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3779US2024356198A1Integrated circuit packages, antenna modules, and communication devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 3879US2024243477A1Wireless communication technology, apparatuses, and methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 3978US10332821B2Partially molded direct chip attach package structures for connectivity module solutionsINTEL IP CORP·Filed 2018·Granted Jun 25, 2019·2 cites·8 claims
- 4076US12322528B2Hybrid cabling solution for higher bandwidth and millimeter wave applicationsAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·19 claims
- 4176US11870132B2Antenna modules and communication devicesINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 4276US11336015B2Antenna boards and communication devicesINTEL IP CORP·Filed 2018·Granted May 17, 2022·2 cites·20 claims
- 4376US2025158269A1Antenna modules and communication devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 4475US12237589B2Wireless communication technology, apparatuses, and methodsINTEL CORP·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 4575US7439840B2Methods and apparatuses for high-performing multi-layer inductorsJACKET MICRO DEVICES INC·Filed 2006·Granted Oct 21, 2008·12 cites·20 claims
- 4674US2023276568A1Apparatus and system of a printed circuit board (pcb) including a radio frequency (rf) transitionINTEL CORP·Filed 2023·Application pending·0 cites
- 4773US2025286027A1System packaging for cellular modem and transceiver system of heterogeneous stackingAPPLE INC·Filed 2025·Application pending·0 cites
- 4872US8358193B2Planar inductor devicesTYCO ELECTRONICS CORP·Filed 2011·Granted Jan 22, 2013·3 cites·20 claims
- 4970US12315853B2System packaging for cellular modem and transceiver system of heterogeneous stackingAPPLE INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 5070US9440378B2Planar electronic device and method for manufacturingDALMIA SIDHARTH·Filed 2012·Granted Sep 13, 2016·3 cites·13 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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