Inventor · disambiguated record
Chan Sun Lee
Also filed as: LEE CHAN SUN
4 granted patents·19 citations·filing 2006–2022
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0180US7652362B2Semiconductor package stack with through-via connectionHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jan 26, 2010·16 cites·8 claims
- 0264US11735559B2Semiconductor packages and manufacturing methods for the sameSK HYNIX INC·Filed 2022·Granted Aug 22, 2023·0 cites·4 claims
- 0359US8024857B2Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 27, 2011·3 cites·27 claims
- 0454US11437342B2Semiconductor packages and manufacturing methods for the sameSK HYNIX INC·Filed 2020·Granted Sep 6, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →