Inventor · disambiguated record
Akira Ouchi
Also filed as: OUCHI AKIRA
6 granted patents·2 pending applications·23 citations·filing 2008–2021
78Inventor score
Top patents by PatentIndex Score
8 records- 0179US8802496B2Substrate for semiconductor package and method of manufacturing thereofSHIBUYA AKINOBU·Filed 2013·Granted Aug 12, 2014·5 cites·3 claims
- 0279US8237292B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2008·Granted Aug 7, 2012·8 cites·8 claims
- 0369US8581403B2Electronic component mounting structure, electronic component mounting method, and electronic component mounting boardOUCHI AKIRA·Filed 2009·Granted Nov 12, 2013·7 cites·20 claims
- 0465US8531023B2Substrate for semiconductor package and method of manufacturing thereofSHIBUYA AKINOBU·Filed 2010·Granted Sep 10, 2013·2 cites·11 claims
- 0560US8669138B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2012·Granted Mar 11, 2014·1 cites·14 claims
- 0648US11476375B2Light detection deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Oct 18, 2022·0 cites·12 claims
- 0742US2010052163A1Semiconductor device, method of manufacturing same and method of repairing sameNEC CORP·Filed 2008·Application pending·0 cites
- 0840US2013012145A1Radio module and manufacturing method thereforNEC CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →