Inventor · disambiguated record
Michael Melzl
Also filed as: MELZL MICHAEL
9 granted patents·1 pending application·23 citations·filing 2000–2015
83Inventor score
Top patents by PatentIndex Score
10 records- 0175US7892947B2Method for machining a workpiece on a workpiece supportINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 22, 2011·6 cites·24 claims
- 0273US7851913B2Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apartINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 14, 2010·6 cites·37 claims
- 0360US8357588B2Method for machining a workpiece on a workpiece supportINFINEON TECHNOLOGIES AG·Filed 2011·Granted Jan 22, 2013·1 cites·1 claims
- 0459US8669666B2Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit elementHAMMER MARKUS·Filed 2010·Granted Mar 11, 2014·1 cites·34 claims
- 0556US7829450B2Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit elementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 9, 2010·1 cites·16 claims
- 0653US10648096B2Electrolyte, method of forming a copper layer and method of forming a chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 12, 2020·0 cites·20 claims
- 0752US6714392B2Electronic component and utilization of a guard structure contained thereinINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 30, 2004·8 cites·8 claims
- 0849US8759230B2Treatment of a substrate with a liquid mediumBRADL STEPHAN·Filed 2008·Granted Jun 24, 2014·0 cites·22 claims
- 0948US7566378B2Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid mediumINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 28, 2009·0 cites·20 claims
- 1036US2001000160A1Method for treatment of semiconductor substratesFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →