Inventor · disambiguated record
Donald William Kidwell, Jr.
Also filed as: KIDWELL DONALD WILLIAM · KIDWELL JR DONALD · KIDWELL JR DONALD WILLIAM
26 granted patents·8 pending applications·130 citations·filing 2012–2021
94Inventor score
Top patents by PatentIndex Score
34 records- 0197US9263370B2Semiconductor device with via barQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·58 cites·26 claims
- 0296US10685924B2Antenna-on-package arrangementsQUALCOMM INC·Filed 2017·Granted Jun 16, 2020·16 cites·12 claims
- 0395US11785399B2Hearable device comprising integrated device and wireless functionalityQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·4 cites·20 claims
- 0493US10734332B2High aspect ratio interconnects in air gap of antenna packageQUALCOMM INC·Filed 2017·Granted Aug 4, 2020·9 cites·31 claims
- 0591US10490880B2Glass-based antenna array packageQUALCOMM INC·Filed 2017·Granted Nov 26, 2019·6 cites·30 claims
- 0691US9496213B2Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrateQUALCOMM INC·Filed 2015·Granted Nov 15, 2016·11 cites·30 claims
- 0790US10497748B2Integrated piezoelectric micromechanical ultrasonic transducer pixel and arrayQUALCOMM INC·Filed 2016·Granted Dec 3, 2019·9 cites·30 claims
- 0884US11206499B2Hearable device comprising integrated device and wireless functionalityQUALCOMM INC·Filed 2017·Granted Dec 21, 2021·4 cites·20 claims
- 0982US9325420B2Electro-optical transceiver device to enable chip-to-chip interconnectionQUALCOMM INC·Filed 2014·Granted Apr 26, 2016·5 cites·30 claims
- 1076US10618079B2Piezoelectric micromechanical ultrasonic transducers and transducer arraysQUALCOMM INC·Filed 2017·Granted Apr 14, 2020·1 cites·25 claims
- 1171US9190208B2Metal-insulator-metal capacitors on glass substratesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Nov 17, 2015·2 cites·28 claims
- 1270US10867740B2Inductor apparatus and method of fabricatingQUALCOMM INC·Filed 2017·Granted Dec 15, 2020·2 cites·28 claims
- 1367US10109784B2Sensor deviceQUALCOMM INC·Filed 2016·Granted Oct 23, 2018·1 cites·30 claims
- 1464US10770646B2Manufacturing method for flexible PMUT arrayQUALCOMM INC·Filed 2017·Granted Sep 8, 2020·1 cites·12 claims
- 1560US8896521B2Metal-insulator-metal capacitors on glass substratesLASITER JON BRADLEY·Filed 2012·Granted Nov 25, 2014·1 cites·31 claims
- 1659US11620806B2Optical character detection using a low-power sensorQUALCOMM INC·Filed 2020·Granted Apr 4, 2023·0 cites·30 claims
- 1759US11532175B1Imaging an object on a displayQUALCOMM INC·Filed 2021·Granted Dec 20, 2022·0 cites·30 claims
- 1855US11877041B2Sensor with multiple focal zonesQUALCOMM INC·Filed 2020·Granted Jan 16, 2024·0 cites·29 claims
- 1955US11711594B2Dual image sensor packageQUALCOMM INC·Filed 2021·Granted Jul 25, 2023·0 cites·30 claims
- 2055US9548350B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2014·Granted Jan 17, 2017·0 cites·9 claims
- 2155US2014104288A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2253US9773862B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2016·Granted Sep 26, 2017·0 cites·14 claims
- 2352US9105602B2Embedded three-dimensional capacitorQUALCOMM INC·Filed 2014·Granted Aug 11, 2015·0 cites·20 claims
- 2451US2014144681A1Adhesive metal nitride on glass and related methodsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2550US2014104284A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2649US11411321B2Broadband antenna systemQUALCOMM INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 2749US10722918B2Release hole plus contact via for fine pitch ultrasound transducer integrationQUALCOMM INC·Filed 2016·Granted Jul 28, 2020·0 cites·14 claims
- 2845US2015311271A1Landside embedded inductor for fanout packagingQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2943US12039749B2Low power visual tracking systemsQUALCOMM INC·Filed 2020·Granted Jul 16, 2024·0 cites·30 claims
- 3042US10199152B2Embedded thin film magnetic carrier for integrated voltage regulatorQUALCOMM INC·Filed 2015·Granted Feb 5, 2019·0 cites·12 claims
- 3138US2014035935A1Passives via barSHENOY RAVINDRA V·Filed 2012·Application pending·0 cites
- 3238US2017271919A1Wireless implant powering via subcutaneous power relayQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3338US2013241939A1High capacitance density metal-insulator-metal capacitorsLASITER JON BRADLEY·Filed 2012·Application pending·0 cites
- 3436US2017343346A1Ultrasonic tilt sensor and related methodsQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →