Inventor · disambiguated record
Phil Neal
Also filed as: NEAL PHIL
3 granted patents·21 citations·filing 2007–2012
67Inventor score
Top patents by PatentIndex Score
3 records- 0191US7932161B2Methods and materials useful for chip stacking, chip and wafer bondingPROMERUS LLC·Filed 2007·Granted Apr 26, 2011·15 cites·43 claims
- 0271US8120168B2Methods and materials useful for chip stacking, chip and wafer bondingAPANIUS CHRIS·Filed 2007·Granted Feb 21, 2012·5 cites·12 claims
- 0359US8816485B2Methods and materials useful for chip stacking, chip and wafer bondingAPANIUS CHRIS·Filed 2012·Granted Aug 26, 2014·1 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →