Assignee

APANIUS CHRIS

US·2 granted patents·6 citations·filing 2007–2012

Technology mixH10D2 H10F2 H10W2 H01L1

Top patents by PatentIndex Score

2 records

0171US8120168B2Methods and materials useful for chip stacking, chip and wafer bondingAPANIUS CHRIS·Filed 2007·Granted Feb 21, 2012·5 cites·12 claims
0259US8816485B2Methods and materials useful for chip stacking, chip and wafer bondingAPANIUS CHRIS·Filed 2012·Granted Aug 26, 2014·1 cites·11 claims

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