Inventor · disambiguated record
Paul Alan Mcconnelee
Also filed as: MCCONNELEE PAUL · MCCONNELEE PAUL A · MCCONNELEE PAUL ALAN
63 granted patents·7 pending applications·864 citations·filing 1979–2020
99Inventor score
Files withGEN ELECTRIC48MCCONNELEE PAUL ALAN7BEAUPRE RICHARD ALFRED2GORCZYCA THOMAS BERT2GOWDA ARUN VIRUPAKSHA2
Top patents by PatentIndex Score
70 records- 0197US8114712B1Method for fabricating a semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 14, 2012·36 cites·22 claims
- 0297US6377461B1Power electronic module packagingGEN ELECTRIC·Filed 2000·Granted Apr 23, 2002·139 cites·15 claims
- 0396US8987876B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Mar 24, 2015·20 cites·42 claims
- 0496US8008125B2System and method for stacked die embedded chip build-upGEN ELECTRIC·Filed 2009·Granted Aug 30, 2011·61 cites·24 claims
- 0595US9209151B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2013·Granted Dec 8, 2015·19 cites·28 claims
- 0695US6515417B1Organic light emitting device and method for mountingGEN ELECTRIC·Filed 2000·Granted Feb 4, 2003·113 cites·24 claims
- 0794US9953913B1Electronics package with embedded through-connect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·10 cites·27 claims
- 0894US9953917B1Electronics package with embedded through-connect and resistor structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·11 cites·34 claims
- 0994US9704788B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2015·Granted Jul 11, 2017·9 cites·30 claims
- 1094US8653635B2Power overlay structure with leadframe connectionsGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Feb 18, 2014·15 cites·14 claims
- 1193US10186477B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2016·Granted Jan 22, 2019·8 cites·20 claims
- 1293US9391027B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2015·Granted Jul 12, 2016·9 cites·19 claims
- 1391US8334593B2Semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2012·Granted Dec 18, 2012·12 cites·14 claims
- 1490US10269688B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Apr 23, 2019·9 cites·21 claims
- 1589US8941208B2Reliable surface mount integrated power moduleCHAUHAN SHAKTI SINGH·Filed 2012·Granted Jan 27, 2015·10 cites·24 claims
- 1688US8049338B2Power semiconductor module and fabrication methodGEN ELECTRIC·Filed 2006·Granted Nov 1, 2011·14 cites·22 claims
- 1788US5576925AFlexible multilayer thin film capacitorsGEN ELECTRIC·Filed 1994·Granted Nov 19, 1996·72 cites·18 claims
- 1887US9299630B2Diffusion barrier for surface mount modulesGOWDA ARUN VIRUPAKSHA·Filed 2012·Granted Mar 29, 2016·10 cites·23 claims
- 1986US6232151B1Power electronic module packagingGEN ELECTRIC·Filed 1999·Granted May 15, 2001·73 cites·16 claims
- 2085US8658473B2Ultrathin buried die module and method of manufacturing thereofMCCONNELEE PAUL ALAN·Filed 2012·Granted Feb 25, 2014·7 cites·20 claims
- 2185US8466007B2Power semiconductor module and fabrication methodDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jun 18, 2013·7 cites·4 claims
- 2285US8114708B2System and method for pre-patterned embedded chip build-upMCCONNELEE PAUL·Filed 2008·Granted Feb 14, 2012·24 cites·15 claims
- 2383US8653670B2Electrical interconnect for an integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 18, 2014·5 cites·21 claims
- 2481US9806051B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Oct 31, 2017·4 cites·17 claims
- 2580US8008781B2Apparatus and method for reducing pitch in an integrated circuitGEN ELECTRIC·Filed 2008·Granted Aug 30, 2011·9 cites·20 claims
- 2680US5774326AMultilayer capacitors using amorphous hydrogenated carbonGEN ELECTRIC·Filed 1995·Granted Jun 30, 1998·58 cites·9 claims
- 2778US9171785B2Power overlay structure with leadframe connectionsGEN ELECTRIC·Filed 2014·Granted Oct 27, 2015·3 cites·12 claims
- 2877US9613843B2Power overlay structure having wirebonds and method of manufacturing sameGEN ELECTRIC·Filed 2014·Granted Apr 4, 2017·3 cites·25 claims
- 2977US8310040B2Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereofBEAUPRE RICHARD ALFRED·Filed 2010·Granted Nov 13, 2012·4 cites·11 claims
- 3076US10453786B2Power electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Oct 22, 2019·2 cites·16 claims
- 3176US7976899B2Methods for selective deposition of graded materials on continuously fed objectsGEN ELECTRIC·Filed 2006·Granted Jul 12, 2011·2 cites·8 claims
- 3275US8623699B2Method of chip package build-upMCCONNELEE PAUL ALAN·Filed 2010·Granted Jan 7, 2014·4 cites·14 claims
- 3375US8586421B2Method of forming semiconductor device package having high breakdown voltage and low parasitic inductanceBEAUPRE RICHARD ALFRED·Filed 2012·Granted Nov 19, 2013·3 cites·20 claims
- 3474US9299647B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2014·Granted Mar 29, 2016·2 cites·30 claims
- 3571US9184124B2Reliable surface mount integrated power moduleGEN ELECTRIC·Filed 2014·Granted Nov 10, 2015·2 cites·21 claims
- 3670US9117813B2Integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2012·Granted Aug 25, 2015·2 cites·6 claims
- 3769US8431444B2Epoxy encapsulating and lamination adhesive and method of making sameGORCZYCA THOMAS BERT·Filed 2011·Granted Apr 30, 2013·2 cites·20 claims
- 3869US7964974B2Electronic chip package with reduced contact pad pitchGEN ELECTRIC·Filed 2008·Granted Jun 21, 2011·4 cites·20 claims
- 3966US11605609B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 4065US4227944AMethods of making composite conductive structures in integrated circuitsGEN ELECTRIC·Filed 1979·Granted Oct 14, 1980·21 cites·16 claims
- 4162US9570376B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2015·Granted Feb 14, 2017·1 cites·20 claims
- 4262US6737002B1Fabrication of plastic module with exposed backside contactLOCKHEED CORP·Filed 2002·Granted May 18, 2004·5 cites·15 claims
- 4361US6146558AStructure and method for molding optical disksGEN ELECTRIC·Filed 1998·Granted Nov 14, 2000·15 cites·10 claims
- 4460US10607957B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Mar 31, 2020·0 cites·15 claims
- 4558US10141203B2Electrical interconnect structure for an embedded electronics packageGEN ELECTRIC·Filed 2017·Granted Nov 27, 2018·0 cites·20 claims
- 4658US10068840B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2017·Granted Sep 4, 2018·0 cites·27 claims
- 4758US9653438B2Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted May 16, 2017·0 cites·23 claims
- 4857US9847236B2Electrical interconnect structure for an embedded electronics packageGEN ELECTRIC·Filed 2017·Granted Dec 19, 2017·0 cites·23 claims
- 4957US9236348B2Ultrathin buried die module and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Jan 12, 2016·0 cites·19 claims
- 5057US9165864B2Power overlay structure with leadframe connectionsGEN ELECTRIC·Filed 2014·Granted Oct 20, 2015·0 cites·19 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →