Inventor · disambiguated record
Yu-Shun Hsieh
Also filed as: HSIEH YU-SHUN
5 granted patents·4 citations·filing 2017–2020
67Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG5
Top patents by PatentIndex Score
5 records- 0177US11462467B2Lead frame, package structure comprising the same and method for manufacturing the package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 4, 2022·1 cites·19 claims
- 0272US10312198B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 4, 2019·2 cites·26 claims
- 0362US11450596B2Lead frame, package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 20, 2022·1 cites·10 claims
- 0453US10797004B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 0545US11139225B2Device including a plurality of leads surrounding a die paddle and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →