Inventor · disambiguated record
Joon Hwan Kwag
Also filed as: KWAG JOON HWAN
6 granted patents·9 pending applications·5 citations·filing 2010–2024
71Inventor score
Top patents by PatentIndex Score
15 records- 0178US10804034B2Capacitor component having secondary phase material contained in external electrode thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 13, 2020·1 cites·19 claims
- 0273US8982534B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 17, 2015·2 cites·12 claims
- 0370US9258893B2Multilayer ceramic electronic part and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 9, 2016·2 cites·13 claims
- 0469US11152155B2Capacitor component having secondary phase material contained in external electrode thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Oct 19, 2021·0 cites·22 claims
- 0566US2025118496A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0666US2025125096A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0757US9153381B2Chip device and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·16 claims
- 0848US2015318112A1Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0945US2015243439A1Multilayer ceramic electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1044US2014022691A1Multilayered ceramic electronic component and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1143US9654079B2Composite electronic component and a board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 16, 2017·0 cites·28 claims
- 1242US2014022689A1Multi-layered ceramic electronic component and method of manufacturing the sameKWAG JOON HWAN·Filed 2012·Application pending·0 cites
- 1342US2014098454A1Multilayered ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1442US2014138137A1Array type multilayer ceramic electronic component, mounting structure of circuit board having array type multilayer ceramic electronic component mounted thereon, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1536US2011149470A1Multilayer ceramic capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →