Inventor · disambiguated record
Katsutoshi Kamei
Also filed as: KAMEI KATSUTOSHI
14 granted patents·7 pending applications·131 citations·filing 2007–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0196US7652890B2Wired circuit boardNITTO DENKO CORP·Filed 2008·Granted Jan 26, 2010·50 cites·3 claims
- 0292US7986495B2Printed circuit board having a layered signal line pair, a suspension boardNITTO DENKO CORP·Filed 2009·Granted Jul 26, 2011·22 cites·12 claims
- 0388US8030576B2Wired circuit board with interposed metal thin film and producing method thereofNITTO DENKO CORP·Filed 2008·Granted Oct 4, 2011·18 cites·4 claims
- 0482US8362365B2Printed circuit board and method of manufacturing the sameNITTO DENKO CORP·Filed 2009·Granted Jan 29, 2013·12 cites·7 claims
- 0579US8664535B2Wired circuit boardKAMEI KATSUTOSHI·Filed 2008·Granted Mar 4, 2014·9 cites·6 claims
- 0676US8049111B2Printed circuit board and method of manufacturing the sameNITTO DENKO CORP·Filed 2009·Granted Nov 1, 2011·3 cites·7 claims
- 0773US8334462B2Wired circuit board assembly sheet including striated portions for enhancing rigidityKAMEI KATSUTOSHI·Filed 2009·Granted Dec 18, 2012·5 cites·7 claims
- 0867US8658903B2Wired circuit boardKAMEI KATSUTOSHI·Filed 2011·Granted Feb 25, 2014·2 cites·4 claims
- 0964US8017874B2Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground tracesNITTO DENKO CORP·Filed 2009·Granted Sep 13, 2011·2 cites·7 claims
- 1063US8869391B2Producing method of wired circuit boardKAMEI KATSUTOSHI·Filed 2011·Granted Oct 28, 2014·2 cites·6 claims
- 1163US8330047B2Printed circuit boardHO VOONYEE·Filed 2009·Granted Dec 11, 2012·4 cites·8 claims
- 1262US8080740B2Printed circuit board and method of manufacturing the sameHONJO MITSURU·Filed 2009·Granted Dec 20, 2011·2 cites·4 claims
- 1360US2024421010A1Sinter bonding sheet rollNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 1452US2009020324A1Wired circuit boardNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1549US2008190652A1Wired circuit board and method for producing the sameNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1648US7895741B2Method of producing a wired circuit boardNITTO DENKO CORP·Filed 2008·Granted Mar 1, 2011·0 cites·6 claims
- 1748US2008000679A1Wired circuit board and producing method thereofNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1848US2009025968A1Wired circuit board and producing method thereofNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1934US2012070661A1Pressure-sensitive adhesive tapeIKISHIMA SHINSUKE·Filed 2011·Application pending·0 cites
- 2034US2012070658A1Pressure-sensitive adhesive tapeIKISHIMA SHINSUKE·Filed 2011·Application pending·0 cites
- 2133US8853551B2Wired circuit board and producing method thereofKAMEI KATSUTOSHI·Filed 2011·Granted Oct 7, 2014·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →