Inventor · disambiguated record
Kwai Hong Wong
Also filed as: WONG KWAI HONG
3 granted patents·5 pending applications·26 citations·filing 2008–2019
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0190US7969018B2Stacked semiconductor chips with separate encapsulationsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·22 cites·20 claims
- 0276US8334586B2Stacked semiconductor chips with separate encapsulationsOTREMBA RALF·Filed 2011·Granted Dec 18, 2012·4 cites·19 claims
- 0340US8664753B2Semiconductor device with protruding component portion and method of packagingLEE TECK SIM·Filed 2009·Granted Mar 4, 2014·0 cites·25 claims
- 0440US2018130769A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0539US2018130768A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0634US2019259731A1Substrate based fan-out wafer level packagingUNISEM M BERHAD·Filed 2019·Application pending·0 cites
- 0729US2019181095A1Emi shielding for discrete integrated circuit packagesUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0828US2018130720A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →