Inventor · disambiguated record
Seung Wan Woo
Also filed as: WOO SEUNG WAN
5 granted patents·9 pending applications·1 citations·filing 2007–2025
61Inventor score
Files withSAMSUNG ELECTRO MECH11ELECTRONICS & TELECOMMUNICATIONS RES INST1SAMSUNG SDI CO LTD1WOO SEUNG WAN1
Top patents by PatentIndex Score
14 records- 0163US7981540B2Rechargeable batterySAMSUNG SDI CO LTD·Filed 2007·Granted Jul 19, 2011·1 cites·18 claims
- 0263US2025336356A1Display device compensating for degradation and method of operating the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 0351US9171780B2Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 27, 2015·0 cites·10 claims
- 0448US9504169B2Printed circuit board having embedded electronic device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 22, 2016·0 cites·13 claims
- 0547US9470635B2System of measuring warpage and method of measuring warpageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 18, 2016·0 cites·11 claims
- 0646US9155192B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·10 claims
- 0742US2014184782A1System of measuring warpage and method of measuring warpageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0841US2014145322A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0941US2014374870A1Image sensor module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1040US2014061891A1Semiconductor chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1140US2015380276A1Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1240US2014145323A1Lamination layer type semiconductor packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1338US2014354797A1Calibration block for measuring warpage, warpage measuring apparatus using the same, and method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1435US2013100460A1Apparatus for measuring warpage characteristic of specimenWOO SEUNG WAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →