Inventor · disambiguated record
Tim Murphy
Also filed as: MURPHY TIM · MURPHY TIM E
15 granted patents·4 pending applications·1,870 citations·filing 1981–2012
95Inventor score
Files withMICRON TECHNOLOGY INC10FARNWORTH WARREN M2MURPHY TIM2ENGELBACH BRIAN1INT MASK RESEARCH FOUNDATION1
Top patents by PatentIndex Score
19 records- 0198US7355273B2Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 8, 2008·455 cites·31 claims
- 0298US6962867B2Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereofMICRONTECHNOLOGY INC·Filed 2003·Granted Nov 8, 2005·600 cites·28 claims
- 0398US6800930B2Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 5, 2004·621 cites·68 claims
- 0495US8072037B2Method and system for electrically coupling a chip to chip packageMURPHY TIM·Filed 2010·Granted Dec 6, 2011·30 cites·20 claims
- 0591US7489875B2System and method for multiple bit optical data transmission in memory systemsMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 10, 2009·19 cites·82 claims
- 0684US7254331B2System and method for multiple bit optical data transmission in memory systemsMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 7, 2007·25 cites·41 claims
- 0781US7335985B2Method and system for electrically coupling a chip to chip packageMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 26, 2008·21 cites·8 claims
- 0878US7015559B2Method and system for electrically coupling a chip to chip packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 21, 2006·17 cites·8 claims
- 0977US4397701AMethod of making masksINT MASK RESEARCH FOUNDATION·Filed 1981·Granted Aug 9, 1983·55 cites·15 claims
- 1073US6831301B2Method and system for electrically coupling a chip to chip packageMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 14, 2004·13 cites·22 claims
- 1172US8866012B2Sensor lead sealing and strain reliefSTONERIDGE INC·Filed 2012·Granted Oct 21, 2014·6 cites·20 claims
- 1272US7732882B2Method and system for electrically coupling a chip to chip packageMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 8, 2010·3 cites·25 claims
- 1359US6936489B2Method and system for electrically coupling a chip to chip packageMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 30, 2005·5 cites·18 claims
- 1453US2008153204A1Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methodsMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1551US9305861B2Method and system for electrically coupling a chip to chip packageMURPHY TIM·Filed 2011·Granted Apr 5, 2016·0 cites·12 claims
- 1645US2007018336A1Stress and force management techniques for a semiconductor dieFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1738US2005206012A1Stress and force management techniques for a semiconductor dieFARNWORTH WARREN M·Filed 2004·Application pending·0 cites
- 1837US8338702B2Sensor lead sealing and strain reliefENGELBACH BRIAN·Filed 2010·Granted Dec 25, 2012·0 cites·20 claims
- 1936US2011083897A1Electric power terminal feed-throughPATEREK DIETER·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →