Inventor · disambiguated record
Sejin Han
Also filed as: HAN SEJIN
5 granted patents·1 pending application·247 citations·filing 1996–2022
81Inventor score
Top patents by PatentIndex Score
6 records- 0189US5817545APressurized underfill encapsulation of integrated circuitsCORNELL RES FOUNDATION INC·Filed 1996·Granted Oct 6, 1998·123 cites·6 claims
- 0285US6000924APressurized underfill encapsulation of integrated circuitsCORNELL RES FOUNDATION INC·Filed 1998·Granted Dec 14, 1999·89 cites·38 claims
- 0367US6023962AReservoir-slit rheometer for the viscosity measurement of fast-reacting polymersCORNELL RES FOUNDATION INC·Filed 1998·Granted Feb 15, 2000·35 cites·25 claims
- 0465US12240971B2Thermoplastic resin composition, method of preparing the same, and molded article including the sameLG CHEMICAL LTD·Filed 2021·Granted Mar 4, 2025·0 cites·14 claims
- 0552US11702536B2Thermoplastic resin composition, method of preparing thermoplastic resin composition, and metal-plated molded article manufactured using thermoplastic resin compositionLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·15 claims
- 0644US2023419003A1Modelling fluid flowAUTODESK INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →