Inventor · disambiguated record
Chihiro Uchibori
Also filed as: UCHIBORI CHIHIRO
8 granted patents·2 pending applications·51 citations·filing 1994–2012
84Inventor score
Top patents by PatentIndex Score
10 records- 0189US8859335B2Method and system for controlling chip inclination during flip-chip mountingFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·11 cites·15 claims
- 0273US6841477B1Metal interconnection, semiconductor device, method for forming metal interconnection and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jan 11, 2005·23 cites·22 claims
- 0372US8975092B2Method and system for controlling chip warpage during bondingFUJITSU LTD·Filed 2012·Granted Mar 10, 2015·3 cites·13 claims
- 0458US8633592B2Hybrid interconnect technologyLEE MICHAEL G·Filed 2011·Granted Jan 21, 2014·1 cites·13 claims
- 0546US5767007AMethod for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrodeSONY CORP·Filed 1994·Granted Jun 16, 1998·8 cites·55 claims
- 0639US7341936B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Mar 11, 2008·0 cites·10 claims
- 0738US5982036AMulti-layered structure for ohmic electrode fabricationSONY CORP·Filed 1997·Granted Nov 9, 1999·4 cites·18 claims
- 0835US2012032327A1Systems and methods for reinforcing chip packagesLEE MICHAEL G·Filed 2010·Application pending·0 cites
- 0931US5904554AMethod for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrodeSONY CORP·Filed 1997·Granted May 18, 1999·1 cites·5 claims
- 1029US2004238891A1Multi-layered structure for fabricating an ohmic electrode and ohmic electrodeFiled 1996·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →