Inventor · disambiguated record
Jun Hisada
Also filed as: HISADA JUN
3 granted patents·2 pending applications·17 citations·filing 2002–2009
66Inventor score
Files withMEC CO LTD5
Top patents by PatentIndex Score
5 records- 0165US6733886B2Laminate and method of manufacturing the sameMEC CO LTD·Filed 2002·Granted May 11, 2004·9 cites·14 claims
- 0264US2010029969A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2009·Application pending·0 cites
- 0352US7029761B2Bonding layer for bonding resin on copper surfaceMEC CO LTD·Filed 2004·Granted Apr 18, 2006·5 cites·7 claims
- 0446US2005003086A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2004·Application pending·0 cites
- 0543US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →