Inventor · disambiguated record
Mutsuyuki Kawaguchi
Also filed as: KAWAGUCHI MUTSUYUKI
5 granted patents·4 pending applications·17 citations·filing 2002–2010
72Inventor score
Top patents by PatentIndex Score
9 records- 0165US6733886B2Laminate and method of manufacturing the sameMEC CO LTD·Filed 2002·Granted May 11, 2004·9 cites·14 claims
- 0255US2010000971A1Adhesive layer forming liquidMEC CO LTD·Filed 2009·Application pending·0 cites
- 0354US2008308964A1Method for forming film of silane coupling agentMEC CO LTD·Filed 2008·Application pending·0 cites
- 0453US2010108531A1Adhesive layer forming liquid and adhesive layer forming processMEC CO LTD·Filed 2009·Application pending·0 cites
- 0552US7029761B2Bonding layer for bonding resin on copper surfaceMEC CO LTD·Filed 2004·Granted Apr 18, 2006·5 cites·7 claims
- 0643US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims
- 0743US2008261020A1Adhesive layer for resin and a method of producing a laminate including the adhesive layerMEC CO LTD·Filed 2007·Application pending·0 cites
- 0840US8828554B2Electroconductive layer, laminate using the same, and producing processes thereofKAWAGUCHI MUTSUYUKI·Filed 2009·Granted Sep 9, 2014·0 cites·11 claims
- 0936US8147631B2Method for forming a laminateKAWAGUCHI MUTSUYUKI·Filed 2010·Granted Apr 3, 2012·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →