Inventor · disambiguated record
Cyprian Emeka Uzoh
Also filed as: UZOH CYPRIAN · UZOH CYPRIAN E · UZOH CYPRIAN EMEKA
408 granted patents·117 pending applications·15,761 citations·filing 1995–2025
99Inventor score
Files withINVENSAS CORP139ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC124IBM65INVENSAS BONDING TECH INC37NUTOOL INC27
Top patents by PatentIndex Score
525 records- 0199US12113056B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·6 cites·53 claims
- 0299US11837596B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·10 cites·35 claims
- 0399US11742315B2Die processingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 29, 2023·5 cites·35 claims
- 0499US11735523B2Laterally unconfined structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 22, 2023·13 cites·16 claims
- 0599US11658173B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 23, 2023·19 cites·27 claims
- 0699US11348898B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2020·Granted May 31, 2022·144 cites·17 claims
- 0799US11244920B2Method and structures for low temperature device bondingINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 8, 2022·78 cites·13 claims
- 0899US10985133B2Die processingINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 20, 2021·144 cites·18 claims
- 0999US10892246B2Structures and methods for low temperature bonding using nanoparticlesINVENSAS CORP·Filed 2020·Granted Jan 12, 2021·144 cites·11 claims
- 1099US10840135B2Flat metal features for microelectronics applicationsINVENSAS CORP·Filed 2019·Granted Nov 17, 2020·143 cites·18 claims
- 1199US10269756B2Die processingINVENSAS BONDING TECH INC·Filed 2018·Granted Apr 23, 2019·216 cites·19 claims
- 1299US10204893B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Feb 12, 2019·203 cites·30 claims
- 1399US7147766B2Chip interconnect and packaging deposition methods and structuresASM NUTOOL INC·Filed 2003·Granted Dec 12, 2006·554 cites·30 claims
- 1499US6497800B1Device providing electrical contact to the surface of a semiconductor workpiece during metal platingNUTOOL INC·Filed 2000·Granted Dec 24, 2002·144 cites·18 claims
- 1599US6413388B1Pad designs and structures for a versatile materials processing apparatusNUTOOL INC·Filed 2000·Granted Jul 2, 2002·191 cites·52 claims
- 1699US6066030AElectroetch and chemical mechanical polishing equipmentIBM·Filed 1999·Granted May 23, 2000·471 cites·47 claims
- 1799US5911619AApparatus for electrochemical mechanical planarizationIBM·Filed 1997·Granted Jun 15, 1999·400 cites·20 claims
- 1899US5884990AIntegrated circuit inductorIBM·Filed 1997·Granted Mar 23, 1999·320 cites·4 claims
- 1998US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
- 2098US12266650B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·3 cites·19 claims
- 2198US12198981B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 14, 2025·3 cites·34 claims
- 2298US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 2398US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 2498US11908739B2Flat metal features for microelectronics applicationsADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Feb 20, 2024·5 cites·15 claims
- 2598US11855064B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 26, 2023·5 cites·32 claims
- 2698US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
- 2798US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
- 2898US11756880B2Interconnect structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 12, 2023·6 cites·28 claims
- 2998US11715730B2Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Aug 1, 2023·6 cites·19 claims
- 3098US11710718B2Structures and methods for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Jul 25, 2023·10 cites·22 claims
- 3198US11694925B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jul 4, 2023·3 cites·36 claims
- 3298US11652083B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 16, 2023·18 cites·29 claims
- 3398US11552041B2Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jan 10, 2023·8 cites·29 claims
- 3498US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 3598US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 3698US11367652B2Microelectronic assembly from processed substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 21, 2022·62 cites·29 claims
- 3798US11348801B2Processing stacked substratesINVENSAS BONDING TECH INC·Filed 2020·Granted May 31, 2022·7 cites·20 claims
- 3898US11329034B2Direct-bonded LED structure contacts and substrate contactsINVENSAS CORP·Filed 2020·Granted May 10, 2022·146 cites·23 claims
- 3998US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 4098US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 4198US11195748B2Interconnect structures and methods for forming sameINVENSAS CORP·Filed 2018·Granted Dec 7, 2021·68 cites·28 claims
- 4298US11158606B2Molded direct bonded and interconnected stackINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·159 cites·35 claims
- 4398US11158573B2Interconnect structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·67 cites·26 claims
- 4498US11088099B2Multi-metal contact structure in microelectronic componentINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 10, 2021·155 cites·21 claims
- 4598US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 4698US11037919B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 15, 2021·88 cites·29 claims
- 4798US11031285B2Diffusion barrier collar for interconnectsINVENSAS BONDING TECH INC·Filed 2018·Granted Jun 8, 2021·159 cites·23 claims
- 4898US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 4998US11004757B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted May 11, 2021·117 cites·20 claims
- 5098US10879226B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·21 cites·24 claims
Showing the top 50 of 525 patent records by PatentIndex Score.
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