Inventor · disambiguated record
Kumpei Yamada
Also filed as: YAMADA KUMPEI
5 granted patents·3 pending applications·0 citations·filing 2016–2024
59Inventor score
Top patents by PatentIndex Score
8 records- 0164US2023095879A1Method for using a buffer sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0260US10880997B2Stretchable member with metal foilHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·8 claims
- 0358US2018340056A1Buffer sheet composition and buffer sheetHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0458US2025297129A1Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0553US11411250B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Aug 9, 2022·0 cites·7 claims
- 0652US11444325B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Sep 13, 2022·0 cites·6 claims
- 0746US11398643B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 26, 2022·0 cites·12 claims
- 0845US11259409B2Conductor substrate, wiring substrate and method for producing wiring substrateHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 22, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →