Inventor · disambiguated record
Pascale Gagnon
Also filed as: GAGNON PASCALE
6 granted patents·37 citations·filing 2011–2021
74Inventor score
Top patents by PatentIndex Score
6 records- 0192US10784202B2High-density chip-to-chip interconnection with silicon bridgeIBM·Filed 2017·Granted Sep 22, 2020·33 cites·15 claims
- 0267US8614900B2Grounded lid for micro-electronic assembliesBEAUMIER MARTIN·Filed 2011·Granted Dec 24, 2013·4 cites·18 claims
- 0361US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 0454US11791270B2Direct bonded heterogeneous integration silicon bridgeIBM·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 0549US11139269B2Mixed under bump metallurgy (UBM) interconnect bridge structureIBM·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 0649US9042120B2Grounded lid for micro-electronic assembliesIBM·Filed 2013·Granted May 26, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →