Inventor · disambiguated record
Chin-Te Su
Also filed as: SU CHIN-TE
6 granted patents·4 pending applications·8 citations·filing 2010–2023
74Inventor score
Files withFENG TAY ENTPR CO LTD3BAUER HOCKEY LLC2CHENG CHUN-FAI2TAIWAN SEMICONDUCTOR MFG CO LTD2LAPERRIÈRE JEAN-FRANÇOIS1
Top patents by PatentIndex Score
10 records- 0177US2024100768A1Three-dimensional printed thermal expansion structure manufacturing methodFENG TAY ENTPR CO LTD·Filed 2023·Application pending·0 cites
- 0272US9756892B2Sport helmetLAPERRIÈRE JEAN-FRANÇOIS·Filed 2011·Granted Sep 12, 2017·3 cites·30 claims
- 0369US8928094B2Strained asymmetric source/drainCHENG CHUN-FAI·Filed 2010·Granted Jan 6, 2015·2 cites·20 claims
- 0468US8872228B2Strained-channel semiconductor device fabricationCHENG CHUN-FAI·Filed 2012·Granted Oct 28, 2014·3 cites·19 claims
- 0567US2020346096A1Method of manufacturing an article of sport gearBAUER HOCKEY LLC·Filed 2020·Application pending·0 cites
- 0665US10751602B2Article of sport gearBAUER HOCKEY LLC·Filed 2017·Granted Aug 25, 2020·0 cites·28 claims
- 0760US2021101331A1Three-dimensional printed thermal expansion structure and manufacturing method of the sameFENG TAY ENTPR CO LTD·Filed 2020·Application pending·0 cites
- 0854US9627507B2Strained asymmetric source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 18, 2017·0 cites·20 claims
- 0947US2021197427A1Molding thermal expansion structure and molding method thereofFENG TAY ENTPR CO LTD·Filed 2020·Application pending·0 cites
- 1046USRE47562EStrained-channel semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 6, 2019·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →