Inventor · disambiguated record
Heung Jae Oh
Also filed as: OH HEUNG JAE
2 granted patents·1 pending application·8 citations·filing 2010–2010
53Inventor score
Top patents by PatentIndex Score
3 records- 0177US8142240B2Lead pin for package substrateOH HEUNG JAE·Filed 2010·Granted Mar 27, 2012·6 cites·2 claims
- 0266US8159064B2Lead pin for package substrate, and method for manufacturing package substrate with the sameOH HEUNG JAE·Filed 2010·Granted Apr 17, 2012·2 cites·16 claims
- 0335US2011014826A1Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →