Inventor · disambiguated record
Marc Sulfridge
Also filed as: SULFRIDGE MARC · SULFRIDGE MARC A · SULFRIDGE Marc Allen
57 granted patents·12 pending applications·340 citations·filing 2005–2024
98Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC40MICRON TECHNOLOGY INC10SEMICONDUCTOR COMPONENTS IND8BORTHAKUR SWARNAL3SULFRIDGE MARC3
Top patents by PatentIndex Score
69 records- 0198US11616152B2Semiconductor devices with single-photon avalanche diodes and hybrid isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 28, 2023·6 cites·20 claims
- 0297US8008192B2Conductive interconnect structures and formation methods using supercritical fluidsMICRON TECHNOLOGY INC·Filed 2010·Granted Aug 30, 2011·33 cites·20 claims
- 0397US7989266B2Methods for separating individual semiconductor devices from a carrierAPTINA IMAGING CORP·Filed 2009·Granted Aug 2, 2011·103 cites·16 claims
- 0496US10797090B2Image sensor with near-infrared and visible light phase detection pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 6, 2020·8 cites·20 claims
- 0595US11289524B2Microlenses for semiconductor device with single-photon avalanche diode pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 29, 2022·10 cites·12 claims
- 0694US10432883B1Backside illuminated global shutter pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 1, 2019·18 cites·20 claims
- 0794US9497366B1Imaging systems with integrated light shield structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 15, 2016·14 cites·20 claims
- 0893US11984519B2Semiconductor devices with single-photon avalanche diodes and hybrid isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 14, 2024·1 cites·20 claims
- 0992US11837670B2Semiconductor devices with single-photon avalanche diodes, light scattering structures, and multiple deep trench isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 5, 2023·3 cites·20 claims
- 1092US11652176B2Semiconductor devices with single-photon avalanche diodes and light scattering structures with different densitiesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 1191US12034025B2Semiconductor devices with single-photon avalanche diodes and isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 1291US9818776B2Integrating bond pad structures with light shielding structures on an image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 14, 2017·9 cites·17 claims
- 1391US7795134B2Conductive interconnect structures and formation methods using supercritical fluidsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 14, 2010·15 cites·40 claims
- 1490US9349767B2Image sensors with through-oxide via structuresSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted May 24, 2016·7 cites·11 claims
- 1590US7884015B2Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·15 cites·18 claims
- 1689US9324755B2Image sensors with reduced stack heightSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Apr 26, 2016·11 cites·16 claims
- 1789US7947601B2Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2009·Granted May 24, 2011·11 cites·19 claims
- 1888US11626440B2Microlens structures for semiconductor device with single-photon avalanche diode pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Apr 11, 2023·2 cites·10 claims
- 1987US10312279B2High dynamic range pixel with in-pixel light shield structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 4, 2019·5 cites·16 claims
- 2087US8497186B2Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor deviceBORTHAKUR SWARNAL·Filed 2011·Granted Jul 30, 2013·6 cites·7 claims
- 2185US10573678B2Microlenses for high dynamic range imaging pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 25, 2020·4 cites·19 claims
- 2285US9041840B2Backside illuminated image sensors with stacked diesSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted May 26, 2015·8 cites·17 claims
- 2384US9064984B2Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 23, 2015·4 cites·4 claims
- 2484US9024406B2Imaging systems with circuit element in carrier waferSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted May 5, 2015·3 cites·20 claims
- 2583US8697473B2Methods for forming backside illuminated image sensors with front side metal redistribution layersBORTHAKUR SWARNAL·Filed 2011·Granted Apr 15, 2014·6 cites·9 claims
- 2682US9293495B2Imaging circuitry with robust scribe line structuresSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Mar 22, 2016·5 cites·18 claims
- 2781US9998643B2Methods of forming curved image sensorsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jun 12, 2018·3 cites·11 claims
- 2881US8853868B2Semiconductor structures including sub-resolution alignment marksMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 7, 2014·4 cites·23 claims
- 2980US12310139B2Semiconductor devices with single-photon avalanche diodes and isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 3080US9293367B2Conductive interconnect structures and formation methods using supercritical fluidsSULFRIDGE MARC·Filed 2011·Granted Mar 22, 2016·4 cites·17 claims
- 3179US9679936B2Imaging systems with through-oxide via connectionsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jun 13, 2017·4 cites·20 claims
- 3276US12034023B2Microlens structures for semiconductor device with single-photon avalanche diode pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 9, 2024·0 cites·19 claims
- 3376US11728360B2Image sensor packages formed using temporary protection layers and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 15, 2023·0 cites·18 claims
- 3475US9515111B2Circuitry for biasing light shielding structures and deep trench isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Dec 6, 2016·2 cites·27 claims
- 3575US9338350B2Image sensors with metallic nanoparticle optical filtersSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted May 10, 2016·2 cites·22 claims
- 3675US8585915B2Methods for fabricating sub-resolution alignment marks on semiconductor structuresPRATT DAVID S·Filed 2007·Granted Nov 19, 2013·5 cites·18 claims
- 3772US11075244B2Die stacked image sensors and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 27, 2021·0 cites·15 claims
- 3871US11342369B2Image sensor packages formed using temporary protection layers and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 24, 2022·0 cites·19 claims
- 3971US10388684B2Image sensor packages formed using temporary protection layers and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Aug 20, 2019·1 cites·19 claims
- 4071US10263030B2Die stacked image sensors and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 16, 2019·1 cites·13 claims
- 4170US2024186350A1Microlenses for semiconductor device with single-photon avalanche diode pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 4269US12113138B2Semiconductor devices with single-photon avalanche diodes and light scattering structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 8, 2024·0 cites·19 claims
- 4368US11942498B2Microlenses for semiconductor device with single-photon avalanche diode pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 26, 2024·0 cites·18 claims
- 4467US12199198B2Semiconductor devices with single-photon avalanche diodes, light scattering structures, and multiple isolation structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4567US10854665B2Semiconductor device and method of forming curved image sensor region robust against bucklingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 4666US10629647B2Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 21, 2020·0 cites·5 claims
- 4764US9362330B2Methods for forming backside illuminated image sensors with front side metal redistribution layers and a permanent carrier layerSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 7, 2016·1 cites·12 claims
- 4862US9635228B2Image sensors with interconnects in cover layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Apr 25, 2017·1 cites·7 claims
- 4962US8247907B2Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methodsSULFRIDGE MARC·Filed 2011·Granted Aug 21, 2012·1 cites·14 claims
- 5059US10374001B2Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 6, 2019·0 cites·13 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →