Inventor · disambiguated record
Takahiro Kida
Also filed as: KIDA TAKAHIRO
9 granted patents·4 pending applications·103 citations·filing 1999–2017
87Inventor score
Top patents by PatentIndex Score
13 records- 0186US7250368B2Semiconductor wafer manufacturing method and waferSHINETSU HANDOTAI KK·Filed 2003·Granted Jul 31, 2007·39 cites·19 claims
- 0284US6558227B1Method for polishing a work and an apparatus for polishing a workSHINETSU HANDOTAI KK·Filed 2000·Granted May 6, 2003·31 cites·4 claims
- 0381US9108289B2Double-side polishing apparatusSHINETSU HANDOTAI KK·Filed 2014·Granted Aug 18, 2015·4 cites·6 claims
- 0478US8834230B2Wafer polishing method and double-side polishing apparatusFURUKAWA DAISUKE·Filed 2009·Granted Sep 16, 2014·6 cites·16 claims
- 0578US8505269B2Method, apparatus and system of eliminating static charge and filling and sterilizing resin vesselKOBAYASHI TOSHIYA·Filed 2010·Granted Aug 13, 2013·6 cites·8 claims
- 0649US2013182363A1Method of eliminating static charge from resin vessel, method of sterilizing and filling resin vessel, method of filling and capping resin vessel, apparatus for eliminating static charge from resin vessel, and resin vessel sterilizing and filling systemKOBAYASHI TOSHIYA·Filed 2013·Application pending·0 cites
- 0745US6764392B2Wafer polishing method and wafer polishing deviceSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 20, 2004·1 cites·29 claims
- 0841US6713429B1Purification catalyst for internal combustion engine exhaust gasDENSO CORP·Filed 1999·Granted Mar 30, 2004·11 cites·10 claims
- 0938US2008125016A1Method for Producing Polishing Agent, Polishing Agent Produced Thereby and Method for Producing Silicon WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 1038US2017366371A1Communication device setting apparatusFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1135US6217417B1Method for polishing thin plate and plate for holding thin plateSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 17, 2001·5 cites·14 claims
- 1235US2018139092A1Information processing apparatus and method for creating configuration information listFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1332US9905411B2Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial waferSHINETSU HANDOTAI KK·Filed 2015·Granted Feb 27, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →