Inventor · disambiguated record
Ying-Nan Wen
Also filed as: WEN YING · WEN YING-NAN
34 granted patents·9 pending applications·228 citations·filing 1998–2023
96Inventor score
Top patents by PatentIndex Score
43 records- 0187US8710680B2Electronic device package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Apr 29, 2014·8 cites·13 claims
- 0287US6268114B1Method for forming fine-pitched solder bumpsIND TECH RES INST·Filed 1998·Granted Jul 31, 2001·97 cites·22 claims
- 0386US10056419B2Chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2018·Granted Aug 21, 2018·4 cites·20 claims
- 0484US9935148B2Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2016·Granted Apr 3, 2018·4 cites·20 claims
- 0584US6365498B1Integrated process for I/O redistribution and passive components fabrication and devices formedIND TECH RES INST·Filed 1999·Granted Apr 2, 2002·74 cites·13 claims
- 0682US10157875B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Dec 18, 2018·4 cites·34 claims
- 0780US9543233B2Chip package having a dual through hole redistribution layer structureXINTEC INC·Filed 2015·Granted Jan 10, 2017·3 cites·9 claims
- 0875US9640405B2Chip package having a laser stop structureXINTEC INC·Filed 2015·Granted May 2, 2017·2 cites·10 claims
- 0975US9406578B2Chip package having extended depression for electrical connection and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Aug 2, 2016·2 cites·22 claims
- 1075US9177919B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 3, 2015·3 cites·23 claims
- 1175US8823179B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2008·Granted Sep 2, 2014·5 cites·24 claims
- 1274US8791768B2Capacitive coupler packaging structureYIU HO-YIN·Filed 2012·Granted Jul 29, 2014·4 cites·20 claims
- 1369US9153707B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 6, 2015·0 cites·20 claims
- 1469US8610271B2Chip package and manufacturing method thereofPERNG BAW-CHING·Filed 2010·Granted Dec 17, 2013·2 cites·13 claims
- 1569US8564133B2Chip package and method for forming the sameWEN YING-NAN·Filed 2010·Granted Oct 22, 2013·3 cites·22 claims
- 1668USD1011958SMagnetic holding strapWEN YING·Filed 2023·Granted Jan 23, 2024·9 cites·1 claims
- 1768US9379072B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Jun 28, 2016·2 cites·20 claims
- 1863US8981497B2Chip package structure and method for forming the sameYIU HO-YIN·Filed 2012·Granted Mar 17, 2015·0 cites·18 claims
- 1963US8410599B2Power MOSFET packagePERNG BAW-CHING·Filed 2010·Granted Apr 2, 2013·2 cites·10 claims
- 2056US2016005787A1Chip package and method for forming the sameXINTEC INC·Filed 2015·Application pending·0 cites
- 2154US9093450B2Chip package and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 28, 2015·0 cites·11 claims
- 2253US8778798B1Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Jul 15, 2014·0 cites·10 claims
- 2350US9780050B2Method of fabricating chip package with laserXINTEC INC·Filed 2016·Granted Oct 3, 2017·0 cites·9 claims
- 2449US9768067B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Sep 19, 2017·0 cites·9 claims
- 2549US8766431B2Power MOSFET packageXINTEC INC·Filed 2013·Granted Jul 1, 2014·0 cites·10 claims
- 2647US9236320B2Chip packageXINTEC INC·Filed 2014·Granted Jan 12, 2016·0 cites·28 claims
- 2746US9281243B2Chip scale package structure and manufacturing method thereofXINTEC INC·Filed 2014·Granted Mar 8, 2016·0 cites·17 claims
- 2845US10140498B2Wafer-level packaging sensing device and method for forming the sameXINTEC INC·Filed 2016·Granted Nov 27, 2018·0 cites·19 claims
- 2945US9812413B2Chip module and method for forming the sameXINTEC INC·Filed 2016·Granted Nov 7, 2017·0 cites·24 claims
- 3043US8692284B2Interposer and manufacturing method thereofWEN YING-NAN·Filed 2012·Granted Apr 8, 2014·0 cites·19 claims
- 3142US9831185B2Chip package and fabrication method thereofXINTEC INC·Filed 2016·Granted Nov 28, 2017·0 cites·20 claims
- 3242US8643070B2Chip package and method for forming the sameCHANG SHU-MING·Filed 2011·Granted Feb 4, 2014·0 cites·20 claims
- 3342US2013127001A1Semiconductor package and method of fabricating the sameXINTEC INC·Filed 2012·Application pending·0 cites
- 3439US9966358B2Chip packageXINTEC INC·Filed 2016·Granted May 8, 2018·0 cites·8 claims
- 3538US9721911B2Chip package and manufacturing method thereofXINTEC INC·Filed 2015·Granted Aug 1, 2017·0 cites·22 claims
- 3638US8614488B2Chip package and method for forming the sameWEN YING-NAN·Filed 2011·Granted Dec 24, 2013·0 cites·20 claims
- 3737US2004089946A1Chip size semiconductor package structureAMKOR TECHNOLOGY INC·Filed 2002·Application pending·0 cites
- 3837US2016229687A1Chip package and fabrication method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 3936US2017047455A1Sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 4035US2016204061A1Chip package and fabrication method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 4135US2016233260A1Chip package and method for forming the sameXINTEC INC·Filed 2016·Application pending·0 cites
- 4234US2015303178A1Chip package and method of manufacturing the sameXINTEC INC·Filed 2015·Application pending·0 cites
- 4334US2015325551A1Chip package and method for forming the sameXINTEC INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →