Inventor · disambiguated record
Hocine Bouzid Ziad
Also filed as: ZIAD HOCINE BOUZID
5 granted patents·35 citations·filing 2008–2015
79Inventor score
Top patents by PatentIndex Score
5 records- 0186US10068791B2Wafer susceptor for forming a semiconductor device and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2013·Granted Sep 4, 2018·8 cites·16 claims
- 0283US9842899B2Semiconductor wafer including a monocrystalline semiconductor layer spaced apart from a poly template layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 12, 2017·4 cites·20 claims
- 0382US7800239B2Thick metal interconnect with metal pad caps at selective sites and process for making the sameSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Sep 21, 2010·10 cites·40 claims
- 0481US9245736B2Process of forming a semiconductor waferSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jan 26, 2016·6 cites·20 claims
- 0577US7947592B2Thick metal interconnect with metal pad caps at selective sites and process for making the sameSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 24, 2011·7 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →