Inventor · disambiguated record
Juik Lee
Also filed as: Lee Juik
11 granted patents·4 pending applications·17 citations·filing 2017–2025
84Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0196US11362053B2Semiconductor chip formed using a cover insulation layer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·7 cites·20 claims
- 0292US11769742B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0390US12040231B2Semiconductor device including TSV and multiple insulating layersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 16, 2024·2 cites·15 claims
- 0478US10600791B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 24, 2020·4 cites·19 claims
- 0577US11133253B2Semiconductor devices including a thick metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·19 claims
- 0674US2025054916A1Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0772US2025300042A1Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0866US10026694B2Semiconductor devices with alignment keysSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·1 cites·15 claims
- 0965US12159859B2Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·9 claims
- 1064US12347747B2Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1160US11616018B2Semiconductor devices including a thick metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1259US2025062255A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1359US2025132228A1Semiconductor chip and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1456US12288734B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 1549US10332842B2Semiconductor devices with alignment keysSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 25, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →