Inventor · disambiguated record
Wei Yeeng Ng
Also filed as: NG WEI YEENG
17 granted patents·2 pending applications·15 citations·filing 2016–2025
89Inventor score
Top patents by PatentIndex Score
19 records- 0196US11844220B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 12, 2023·2 cites·14 claims
- 0289US10707121B2Solid state memory device, and manufacturing method thereofINTEL CORP·Filed 2016·Granted Jul 7, 2020·9 cites·24 claims
- 0385US2025107094A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0484US12256546B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 18, 2025·0 cites·24 claims
- 0583US12310024B2Microelectronic devices including oxide material between decks thereof, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted May 20, 2025·0 cites·15 claims
- 0681US2025261373A1Memory devices including oxide material between decks thereofLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0777US12063783B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Aug 13, 2024·0 cites·2 claims
- 0875US11917825B2Microelectronic devices including an oxide material between adjacent decksMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 27, 2024·0 cites·17 claims
- 0975US11205654B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 21, 2021·2 cites·25 claims
- 1071US11805645B2Integrated assemblies having rugged material fill, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 31, 2023·1 cites·81 claims
- 1171US11626423B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 11, 2023·0 cites·8 claims
- 1271US11621273B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 4, 2023·0 cites·41 claims
- 1369US12347732B2Systems and methods for mitigating crack propagation in semiconductor die manufacturingMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 1, 2025·0 cites·17 claims
- 1468US11700729B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 1568US10304749B2Method and apparatus for improved etch stop layer or hard mask layer of a memory deviceINTEL CORP·Filed 2017·Granted May 28, 2019·1 cites·13 claims
- 1664US11075219B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 1761US11637040B2Systems and methods for mitigating crack propagation in semiconductor die manufacturingMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 25, 2023·0 cites·20 claims
- 1861US11355514B2Microelectronic devices including an oxide material between adjacent decks, electronic systems, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 7, 2022·0 cites·26 claims
- 1939US10580782B2Methods of forming an array of elevationally-extending strings of memory cells individually comprising a programmable charge-storage transistorMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·0 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when Wei Yeeng Ng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →