Inventor · disambiguated record
Chin-Jong Chan
Also filed as: CHAN CHIN-JONG
6 granted patents·1 pending application·271 citations·filing 1994–2001
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0183US5471092AMetallurgical joint including a stress release layerIBM·Filed 1994·Granted Nov 28, 1995·75 cites·25 claims
- 0280US6181016B1Bond-pad with a single anchoring structureWINBOND ELECTRONICS CORP·Filed 1999·Granted Jan 30, 2001·63 cites·15 claims
- 0373US6313541B1Bone-pad with pad edge strengthening structureWINBOND ELECTRONICS CORP·Filed 1999·Granted Nov 6, 2001·44 cites·21 claims
- 0464US6551916B2Bond-pad with pad edge strengthening structureWINBOND ELECTRONICS CORP·Filed 1999·Granted Apr 22, 2003·31 cites·9 claims
- 0560US6002179ABonding pad structure for integrated circuit (I)WINBOND ELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·30 cites·22 claims
- 0656US5962919ABonding pad structure for integrated circuit (III)WINBOND ELECTRONICS CORP·Filed 1998·Granted Oct 5, 1999·28 cites·16 claims
- 0734US2001020749A1Bond-pad with pad edge strengthening structureFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →