Inventor · disambiguated record
Lay Yeap Lim
Also filed as: LIM LAY YEAP
9 granted patents·1 pending application·29 citations·filing 2007–2016
84Inventor score
Top patents by PatentIndex Score
10 records- 0187US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 0275US9728492B1Strip testing of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 8, 2017·4 cites·21 claims
- 0374US9252063B2Extended contact area for leadframe strip testingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 2, 2016·3 cites·17 claims
- 0473US9303327B2Electric component with an electrophoretically deposited filmINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 5, 2016·7 cites·20 claims
- 0573US9263419B2Lead frame strips with electrical isolation of die paddlesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 16, 2016·3 cites·16 claims
- 0671US7923301B2Etched leadframe structureFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Apr 12, 2011·3 cites·12 claims
- 0754US9159656B2Semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 0849US7683463B2Etched leadframe structure including recessesFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Mar 23, 2010·0 cites·27 claims
- 0937US8110447B2Method of making and designing lead frames for semiconductor packagesLIM LAY YEAP·Filed 2008·Granted Feb 7, 2012·0 cites·7 claims
- 1036US2009189261A1Ultra-Thin Semiconductor PackageLIM LAY YEAP·Filed 2008·Application pending·0 cites
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