Inventor · disambiguated record
Perre Kao
Also filed as: KAO PERRE
4 granted patents·2 pending applications·3 citations·filing 2008–2020
65Inventor score
Top patents by PatentIndex Score
6 records- 0170US8941232B2Metal bumps for cooling device connectionCHOU YOU-HUA·Filed 2011·Granted Jan 27, 2015·2 cites·20 claims
- 0269US11488891B2Method of forming conductive bumps for cooling device connection and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 0366US9899296B2Method of forming conductive bumps for cooling device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·1 cites·20 claims
- 0459US10651111B2Method of forming conductive bumps for cooling device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 0550US2009233447A1Control wafer reclamation processTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 0644US2011223767A1Control wafer reclamation processTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →