Inventor · disambiguated record

Bingjie Cai

Also filed as: CAI BINGJIE

1 granted patent·31 citations·filing 2016–2016

44Inventor score

Technology areasH01L

Files withXIANGNENG HUALEI OPTOELECTRONIC CO LTD1

Top patents by PatentIndex Score

1 record

0188US10147849B2Manufacturing method of flip-chip structure of group III semiconductor light emitting deviceXIANGNENG HUALEI OPTOELECTRONIC CO LTD·Filed 2016·Granted Dec 4, 2018·31 cites·14 claims

Join the waitlist — get patent alerts

Get an alert when Bingjie Cai files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →