Inventor · disambiguated record
Kenichi Takao
Also filed as: TAKAO KENICHI
7 granted patents·5 pending applications·4 citations·filing 2002–2024
72Inventor score
Files withTOYO SEIKAN GROUP HOLDINGS LTD8SHIROISHI RYOZO1TOYO SEIKAN CO LTD1TOYO SEIKAN KAISHA LTD1TOYO SEIKAN KASHA LTD1
Top patents by PatentIndex Score
12 records- 0169US12343778B2Die for ironing working and die moduleTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2020·Granted Jul 1, 2025·0 cites·2 claims
- 0269US9630372B2Method of producing pressed paper piece and apparatus thereforTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2013·Granted Apr 25, 2017·2 cites·4 claims
- 0364US12157602B2Aluminum canTOYO SEIKAN CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·1 claims
- 0461US9149901B2Method of polishing the diamond-surfaceSHIROISHI RYOZO·Filed 2011·Granted Oct 6, 2015·2 cites·20 claims
- 0561US2024234882A1Double seaming structure and battery and can having sameTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2024·Application pending·0 cites
- 0657US2018229287A1Die for ironing working and die moduleTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2016·Application pending·0 cites
- 0754US11338954B2Aluminum canTOYO SEIKAN KAISHA LTD·Filed 2017·Granted May 24, 2022·0 cites·7 claims
- 0854US10155293B2Diamond surface polishing method and apparatus for implementing sameTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2017·Granted Dec 18, 2018·0 cites·19 claims
- 0950US11267033B2Mold and method for manufacturing drawn canTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2016·Granted Mar 8, 2022·0 cites·9 claims
- 1041US2020055147A1Method of forming grooves of a fine periodic structure in the surface of the diamondTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2017·Application pending·0 cites
- 1140US2017106494A1Polishing deviceTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2016·Application pending·0 cites
- 1234US2005205575A1Container sealing structure, container with the sealing structure, and method of manufacturing the sealing structureTOYO SEIKAN KASHA LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →