Inventor · disambiguated record
Thomas E. Dueber
Also filed as: DUEBER THOMAS E · DUEBER THOMAS EUGENE
21 granted patents·12 pending applications·875 citations·filing 1978–2008
96Inventor score
Files withDU PONT21DUEBER THOMAS E3DUEBER THOMAS EUGENE3BORLAND WILLIAM J1CDA PROC LTD LIABILITY COMPANY1
Top patents by PatentIndex Score
33 records- 0198US4162162ADerivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositionsDU PONT·Filed 1978·Granted Jul 24, 1979·218 cites·17 claims
- 0295US4565769APolymeric sensitizers for photopolymer compositionDU PONT·Filed 1984·Granted Jan 21, 1986·144 cites·11 claims
- 0392US4535052AConstrained n-alkylamino aryl ketones as sensitizers for photopolymer compositionsDU PONT·Filed 1984·Granted Aug 13, 1985·58 cites·10 claims
- 0490US7745516B2Composition of polyimide and sterically-hindered hydrophobic epoxyDU PONT·Filed 2005·Granted Jun 29, 2010·18 cites·28 claims
- 0589US4613560APhotosensitive ceramic coating compositionDU PONT·Filed 1984·Granted Sep 23, 1986·60 cites·6 claims
- 0687US6218074B1Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuitsDU PONT·Filed 1999·Granted Apr 17, 2001·102 cites·48 claims
- 0785US4724021AMethod for making porous bottom-layer dielectric composite structureDU PONT·Filed 1986·Granted Feb 9, 1988·73 cites·9 claims
- 0884US7579134B2Polyimide composite coverlays and methods and compositions relating theretoDU PONT·Filed 2005·Granted Aug 25, 2009·15 cites·12 claims
- 0981US7220490B2Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating theretoDU PONT·Filed 2004·Granted May 22, 2007·17 cites·11 claims
- 1078US7348373B2Polyimide compositions having resistance to water sorption, and methods relating theretoDU PONT·Filed 2004·Granted Mar 25, 2008·13 cites·13 claims
- 1173US5536620APliable, aqueous processable, photopolymerizable permanent coating for printed circuitsDU PONT·Filed 1994·Granted Jul 16, 1996·27 cites·16 claims
- 1271US4477556AAcidic o-nitroaromatics as photoinhibitors of polymerization in positive working filmsDU PONT·Filed 1982·Granted Oct 16, 1984·25 cites·11 claims
- 1371US4454218AN-Alkylindolylidene and N-alkylbenzo-thiazolylidene alkanones as sensitizers for photopolymer compositionsDU PONT·Filed 1982·Granted Jun 12, 1984·26 cites·17 claims
- 1470US5728505AFlexible, aqueous processable, photoimageable permanent coatings for printed circuitsDU PONT·Filed 1997·Granted Mar 17, 1998·30 cites·30 claims
- 1567US5643657AAqueous processable, multilayer, photoimageable permanent coatings for printed circuitsDU PONT·Filed 1995·Granted Jul 1, 1997·27 cites·39 claims
- 1653US4504566ASingle exposure positive contact multilayer photosolubilizable litho element with two quinone diazide layersDU PONT·Filed 1984·Granted Mar 12, 1985·11 cites·9 claims
- 1752US8270145B2Screen-printable encapsulants based on soluble polybenzoxazolesDUEBER THOMAS EUGENE·Filed 2007·Granted Sep 18, 2012·1 cites·22 claims
- 1851US7476489B2Low-temperature curable photosensitive compositionsDU PONT·Filed 2005·Granted Jan 13, 2009·0 cites·15 claims
- 1951US4555473AAlkali developable photopolymer crystalline compositionDU PONT·Filed 1984·Granted Nov 26, 1985·10 cites·10 claims
- 2050US2005154105A1Compositions with polymers for advanced materialsFiled 2004·Application pending·0 cites
- 2149US2007083016A1Photosensitive polyimide compositionsDU PONT·Filed 2006·Application pending·0 cites
- 2249US2007290379A1Hydrophobic compositions for electronic applicationsDUEBER THOMAS E·Filed 2006·Application pending·0 cites
- 2348US2009017309A1Compositions and methods for creating electronic circuitryDU PONT·Filed 2008·Application pending·0 cites
- 2446US2005079442A1Halo resistent, photoimagable coverlay compositions, having advantageous application and removal properties, and methods relating theretoFiled 2004·Application pending·0 cites
- 2546US2007291440A1Organic encapsulant compositions based on heterocyclic polymers for protection of electronic componentsDUEBER THOMAS E·Filed 2006·Application pending·0 cites
- 2645US2008118633A1Methods for creating electronic circuitry comprising phenolic epoxy binder compositionsCHEN CHENG-CHUNG·Filed 2007·Application pending·0 cites
- 2745US2007244267A1Hydrophobic crosslinkable compositions for electronic applicationsDUEBER THOMAS E·Filed 2006·Application pending·0 cites
- 2844US8357753B2Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazolesCDA PROC LTD LIABILITY COMPANY·Filed 2008·Granted Jan 22, 2013·0 cites·17 claims
- 2944US7524617B2Low-temperature curable photosensitive compositionsDU PONT·Filed 2004·Granted Apr 28, 2009·0 cites·9 claims
- 3044US2009156715A1Epoxy compositions comprising at least one elastomer and methods relating theretoDUEBER THOMAS EUGENE·Filed 2007·Application pending·0 cites
- 3141US2009111948A1Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating theretoDUEBER THOMAS EUGENE·Filed 2007·Application pending·0 cites
- 3241US2007236859A1Organic encapsulant compositions for protection of electronic componentsBORLAND WILLIAM J·Filed 2006·Application pending·0 cites
- 3340US2004058276A1Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating theretoFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →