Inventor · disambiguated record
David G. Wontor
Also filed as: WONTOR DAVID G
7 granted patents·1 pending application·663 citations·filing 2003–2011
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0198US6921975B2Circuit device with at least partial packaging, exposed active surface and a voltage reference planeFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 26, 2005·233 cites·23 claims
- 0298US6838776B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 4, 2005·314 cites·43 claims
- 0397US7361987B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 22, 2008·75 cites·15 claims
- 0490US7622309B2Mechanical integrity evaluation of low-k devices with bump shearFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 24, 2009·23 cites·17 claims
- 0583US7247552B2Integrated circuit having structural support for a flip-chip interconnect pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 24, 2007·12 cites·20 claims
- 0668US8072062B2Circuit device with at least partial packaging and method for formingLEAL GEORGE R·Filed 2008·Granted Dec 6, 2011·3 cites·14 claims
- 0766US8053349B2BGA package with traces for plating pads under the chipTEXAS INSTRUMENTS INC·Filed 2008·Granted Nov 8, 2011·3 cites·13 claims
- 0840US2012013003A1Bga package with traces for plating pads under the chipRHYNER KENNETH R·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →