Inventor · disambiguated record
Hyun-Jong Oh
Also filed as: OH HYUN-JONG
9 granted patents·3 pending applications·91 citations·filing 2004–2018
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7HYUNDAI MOTOR CO LTD1KOREA ELECTRONICS TELECOMM1OH HYUN JONG1SHIN DONG-WOO1
Top patents by PatentIndex Score
12 records- 0188US7518873B2Heat spreader, semiconductor package module and memory module having the heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·20 cites·37 claims
- 0287US7606035B2Heat sink and memory module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·19 cites·23 claims
- 0386US7613344B2System and method for encoding and decoding an image using bitstream map and recording medium thereofKOREA ELECTRONICS TELECOMM·Filed 2004·Granted Nov 3, 2009·34 cites·31 claims
- 0480US11569678B2System for estimating initial SOC of lithium battery of vehicle and control method thereofHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jan 31, 2023·4 cites·17 claims
- 0580US7920383B2Heat sink for dissipating heat and apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Apr 5, 2011·9 cites·19 claims
- 0661US8395553B2Mobile terminal having antenna mounted in flexible PCB of side keyOH HYUN JONG·Filed 2009·Granted Mar 12, 2013·5 cites·20 claims
- 0750US8148828B2Semiconductor packaging deviceSHIN DONG-WOO·Filed 2009·Granted Apr 3, 2012·0 cites·39 claims
- 0847US8053889B2Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·0 cites·17 claims
- 0943US2010006260A1Heat sinkSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1039US2006228878A1Semiconductor package repair methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1137US2010210042A1Method of manufacturing semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 1228US9056377B2Router apparatusYUN CHAN-HYUNG·Filed 2011·Granted Jun 16, 2015·0 cites·11 claims
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