Inventor · disambiguated record
De-Hao Lu
Also filed as: LU DE F · Lu de-hao
7 granted patents·3 pending applications·1 citations·filing 2004–2013
68Inventor score
Top patents by PatentIndex Score
10 records- 0160US8312624B1Method for manufacturing a heat dissipation structure of a printed circuit boardCHANG CHIEN-WEI·Filed 2011·Granted Nov 20, 2012·1 cites·4 claims
- 0251US9095084B2Stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·4 claims
- 0349US9095085B2Method of manufacturing a stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·8 claims
- 0446US8875390B2Method of manufacturing a laminate circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Nov 4, 2014·0 cites·6 claims
- 0545US2014116755A1Laminate circuit board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Application pending·0 cites
- 0643US8766102B2Chip support board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Jul 1, 2014·0 cites·8 claims
- 0742US8941224B2Package structure of a chip and a substrateKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jan 27, 2015·0 cites·4 claims
- 0840US8887386B2Method of manufacturing a chip support board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Nov 18, 2014·0 cites·6 claims
- 0940US2014295623A1Method of packaging a chip and a substrateKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 1036US2005214182A1Small ozone generator moduleHONG CHI TECHNOLOGY CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →