Inventor · disambiguated record
David Sheasley
Also filed as: SHEASLEY DAVID
12 granted patents·1 pending application·177 citations·filing 2005–2019
90Inventor score
Top patents by PatentIndex Score
13 records- 0196US7892396B2Toughened activatable material for sealing, baffling or reinforcing and method of forming sameZEPHYROS INC·Filed 2007·Granted Feb 22, 2011·74 cites·7 claims
- 0294US7984919B2Structural mounting insert having a non-conductive isolatorZEPHYROS INC·Filed 2009·Granted Jul 26, 2011·32 cites·19 claims
- 0394US7438782B2Activatable material for sealing, baffling or reinforcing and method of forming sameZEPHYROS INC·Filed 2006·Granted Oct 21, 2008·34 cites·20 claims
- 0492US7180027B2Method of applying activatable material to a memberL & L PRODUCTS INC·Filed 2005·Granted Feb 20, 2007·12 cites·20 claims
- 0589US8105460B2Handling layer and adhesive parts formed therewithSHEASLEY DAVID·Filed 2007·Granted Jan 31, 2012·10 cites·19 claims
- 0684US8702889B2Method of forming a toughened adhesive materialSHEASLEY DAVID·Filed 2008·Granted Apr 22, 2014·7 cites·14 claims
- 0773US8459675B2Structural mounting insert having a non-conductive isolatorNITSCHE OLAF·Filed 2011·Granted Jun 11, 2013·3 cites·20 claims
- 0871US9879162B2Method for formation and application of adhesiveZEPHYROS INC·Filed 2014·Granted Jan 30, 2018·1 cites·17 claims
- 0971US8741094B2Handling layer and adhesive parts formed therewithSHEASLEY DAVID·Filed 2012·Granted Jun 3, 2014·3 cites·19 claims
- 1066US10240075B2Bonding dissimilar materials with adhesive pasteZEPHYROS INC·Filed 2014·Granted Mar 26, 2019·0 cites·19 claims
- 1166US2019218435A1Bonding Dissimilar Materials with Adhesive PasteZEPHYROS INC·Filed 2019·Application pending·0 cites
- 1265US11629275B2Method for formation and application of adhesiveZEPHYROS INC·Filed 2018·Granted Apr 18, 2023·0 cites·15 claims
- 1360US8808478B2Structural mounting insert having a non-conductive isolatorZEPHYROS INC·Filed 2013·Granted Aug 19, 2014·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →