Inventor · disambiguated record
Vadim Tsoi
Also filed as: TSOI VADIM
10 granted patents·3 pending applications·81 citations·filing 2002–2025
85Inventor score
Top patents by PatentIndex Score
13 records- 0190US9941917B2Base stationHUAWEI TECH CO LTD·Filed 2015·Granted Apr 10, 2018·9 cites·25 claims
- 0289US9423192B2Heat spreading device and method with sectioning forming multiple chambersTSOI VADIM·Filed 2011·Granted Aug 23, 2016·26 cites·20 claims
- 0384US7061763B2Cabinet coolingERICSSON TELEFON AB L M·Filed 2002·Granted Jun 13, 2006·40 cites·21 claims
- 0479US9843250B2Electro hydro dynamic cooling for heat sinkHUAWEI TECH CO LTD·Filed 2014·Granted Dec 12, 2017·6 cites·26 claims
- 0564US12495524B2Heat spreader for transferring heat from an electronic heat source to a heat sinkHUAWEI TECH CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0656US12222165B2Apparatus for transferring heat from a heat source to airHUAWEI TECH CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·16 claims
- 0756US10757832B2Radio remote unit and communications deviceHUAWEI TECH CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·20 claims
- 0849US12457711B2Apparatus for transferring heat from a heat source to airHUAWEI TECH CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·16 claims
- 0949US10219406B2Radio remote unit and communications deviceHUAWEI TECH CO LTD·Filed 2015·Granted Feb 26, 2019·0 cites·22 claims
- 1047US12114467B2Heatsink with increased air flowHUAWEI TECH CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·18 claims
- 1145US2013098587A1Method and device of heat transportHUAWEI TECH CO LTD·Filed 2012·Application pending·0 cites
- 1244US2025254830A1Two-phase heat sink for cooling heat sourcesHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 1340US2013199208A1Liquid cooling system and method for cooling at least one heat generating componentHUAWEI TECH CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →