Inventor · disambiguated record
Tomohiro Yorisue
Also filed as: YORISUE TOMOHIRO
8 granted patents·6 pending applications·6 citations·filing 2007–2024
77Inventor score
Files withASAHI CHEMICAL IND10ASAHI KASEI E MATERIALS CORP1ASAKAWA KOJI1KIMURA MASASHI1YORISUE TOMOHIRO1
Top patents by PatentIndex Score
14 records- 0182US2023221639A1Photosensitive resin composition and method for producing cured relief patternASAHI CHEMICAL IND·Filed 2023·Application pending·0 cites
- 0280US11640112B2Photosensitive resin composition and method for producing cured relief patternASAHI CHEMICAL IND·Filed 2021·Granted May 2, 2023·0 cites·35 claims
- 0378US2024329525A1Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatusASAHI CHEMICAL IND·Filed 2024·Application pending·0 cites
- 0476US2024210827A1Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatusASAHI CHEMICAL IND·Filed 2023·Application pending·0 cites
- 0575US10719016B2Photosensitive resin composition, polyimide production method, and semiconductor deviceASAHI CHEMICAL IND·Filed 2016·Granted Jul 21, 2020·2 cites·14 claims
- 0671US10831101B2Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatusASAHI CHEMICAL IND·Filed 2017·Granted Nov 10, 2020·1 cites·19 claims
- 0770US11809079B2Photosensitive resin composition, polyimide production method, and semiconductor deviceASAHI CHEMICAL IND·Filed 2022·Granted Nov 7, 2023·0 cites·8 claims
- 0868US11163234B2Photosensitive resin composition and method for producing cured relief patternASAHI CHEMICAL IND·Filed 2017·Granted Nov 2, 2021·0 cites·4 claims
- 0965US2020409263A1Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatusASAHI CHEMICAL IND·Filed 2020·Application pending·0 cites
- 1064US8557498B2Photosensitive resin compositionYORISUE TOMOHIRO·Filed 2008·Granted Oct 15, 2013·3 cites·5 claims
- 1156US2020301273A1Photosensitive resin composition, polyimide production method, and semiconductor deviceASAHI CHEMICAL IND·Filed 2020·Application pending·0 cites
- 1249US8043899B2Photosensitive resin compositionASAHI KASEI E MATERIALS CORP·Filed 2008·Granted Oct 25, 2011·0 cites·5 claims
- 1340US2010019399A1Polyorganosiloxane compositionKIMURA MASASHI·Filed 2007·Application pending·0 cites
- 1438US8628673B2Resin composition for pattern formation, pattern formation method and process for producing light-emitting elementASAKAWA KOJI·Filed 2010·Granted Jan 14, 2014·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →