Inventor · disambiguated record
Cinti X. Chen
Also filed as: CHEN CINTI · CHEN CINTI X · CHEN CINTI XIAOHUA
16 granted patents·133 citations·filing 2003–2019
92Inventor score
Top patents by PatentIndex Score
16 records- 0189US8987009B1Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) productXILINX INC·Filed 2013·Granted Mar 24, 2015·8 cites·12 claims
- 0288US6744105B1Memory array having shallow bit line with silicide contact portion and method of formationADVANCED MICRO DEVICES INC·Filed 2003·Granted Jun 1, 2004·47 cites·8 claims
- 0381US6765254B1Structure and method for preventing UV radiation damage and increasing data retention in memory cellsADVANCED MICRO DEVICES INC·Filed 2003·Granted Jul 20, 2004·30 cites·13 claims
- 0476US8022468B1Ultraviolet radiation blocking interlayer dielectricSPANSION LLC·Filed 2005·Granted Sep 20, 2011·7 cites·12 claims
- 0575US8402412B1Increasing circuit speed and reducing circuit leakage by utilizing a local surface temperature effectCHEN CINTI X·Filed 2011·Granted Mar 19, 2013·4 cites·16 claims
- 0674US7341956B1Disposable hard mask for forming bit linesSPANSION LLC·Filed 2005·Granted Mar 11, 2008·4 cites·19 claims
- 0774US7238571B1Non-volatile memory device with increased reliabilitySPANSION LLC·Filed 2005·Granted Jul 3, 2007·4 cites·18 claims
- 0873US6974989B1Structure and method for protecting memory cells from UV radiation damage and UV radiation-induced charging during backend processingSPANSION LLC·Filed 2004·Granted Dec 13, 2005·13 cites·20 claims
- 0967US9236367B1Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) productXILINX INC·Filed 2015·Granted Jan 12, 2016·1 cites·17 claims
- 1065US8311659B1Identifying non-randomness in integrated circuit product yieldCHEN CINTI X·Filed 2009·Granted Nov 13, 2012·2 cites·11 claims
- 1165US7977218B2Thin oxide dummy tiling as charge protectionSPANSION LLC·Filed 2006·Granted Jul 12, 2011·3 cites·20 claims
- 1261US8166445B1Estimating Icc current temperature scaling factor of an integrated circuitCHEN CINTI X·Filed 2009·Granted Apr 24, 2012·2 cites·20 claims
- 1360US9214433B2Charge damage protection on an interposer for a stacked die assemblyXILINX INC·Filed 2013·Granted Dec 15, 2015·1 cites·19 claims
- 1458US11762958B1Markov decision process based recipe generation for multi-chip apparatusXILINX INC·Filed 2019·Granted Sep 19, 2023·0 cites·20 claims
- 1555US7242102B2Bond pad structure for copper metallization having increased reliability and method for fabricating sameSPANSION LLC·Filed 2004·Granted Jul 10, 2007·6 cites·7 claims
- 1648US7122465B1Method for achieving increased control over interconnect line thickness across a wafer and between wafersSPANSION LLC·Filed 2004·Granted Oct 17, 2006·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →