Inventor · disambiguated record
Charles Odegard
Also filed as: ODEGARD CHARLES · ODEGARD CHARLES A · ODEGARD CHARLES ANTHONY
15 granted patents·12 pending applications·114 citations·filing 2001–2012
92Inventor score
Files withTEXAS INSTRUMENTS INC21ODEGARD CHARLES A2CHIU TZ-CHENG1ODEGARD CHARLES ANTHONY1STILLMAN DANIEL JOSEPH1
Top patents by PatentIndex Score
27 records- 0186US6869831B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 22, 2005·35 cites·12 claims
- 0276US7319275B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 15, 2008·5 cites·10 claims
- 0374US6798212B2Time domain reflectometer probe having a built-in reference ground pointTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 28, 2004·22 cites·17 claims
- 0473US7598124B2System and method to increase die stand-off heightTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 6, 2009·4 cites·18 claims
- 0571US7224071B2System and method to increase die stand-off heightTEXAS INSTRUMENTS INC·Filed 2003·Granted May 29, 2007·13 cites·9 claims
- 0670US7393719B2Increased stand-off height integrated circuit assemblies, systems, and methodsTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 1, 2008·4 cites·6 claims
- 0770US6855578B2Vibration-assisted method for underfilling flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 15, 2005·13 cites·6 claims
- 0862US7550314B2Patterned plasma treatment to improve distribution of underfill materialTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 23, 2009·2 cites·4 claims
- 0962US6977429B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 20, 2005·9 cites·7 claims
- 1061US7445960B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 4, 2008·1 cites·10 claims
- 1160US7276401B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 2, 2007·1 cites·10 claims
- 1260US7271494B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·1 cites·6 claims
- 1357US7323362B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 29, 2008·1 cites·4 claims
- 1450US2008218986A1Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and MethodsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1550US2008003721A1Vibration-Assisted Method for Underfilling Flip-Chip Electronic DevicesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1649US7045904B2Patterned plasma treatment to improve distribution of underfill materialTEXAS INSTRUMENTS INC·Filed 2003·Granted May 16, 2006·3 cites·16 claims
- 1747US2008085573A1Underfill dispense at substrate apertureTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1846US2005253281A1Vibration-assisted method for underfilling flip-chip electronic devicesODEGARD CHARLES A·Filed 2005·Application pending·0 cites
- 1943US2009039524A1Methods and apparatus to support an overhanging region of a stacked dieTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2042US2007269930A1Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)TEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2141US2006234427A1Underfill dispense at substrate apertureODEGARD CHARLES A·Filed 2005·Application pending·0 cites
- 2241US2009189299A1Method of forming a probe pad layout/design, and related deviceTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 2340US2009166810A1Semiconductor Device Crack-Deflecting Structure and MethodSTILLMAN DANIEL JOSEPH·Filed 2007·Application pending·0 cites
- 2439US2006270106A1System and method for polymer encapsulated solder lid attachCHIU TZ-CHENG·Filed 2005·Application pending·0 cites
- 2537US8674504B2Wire-based methodology of widening the pitch of semiconductor chip terminalsODEGARD CHARLES ANTHONY·Filed 2012·Granted Mar 18, 2014·0 cites·21 claims
- 2636US2005151273A1Semiconductor chip packageFiled 2003·Application pending·0 cites
- 2733US2008246491A1Scalable method for identifying cracks and fractures under wired or ball bonded bond padsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →