Inventor · disambiguated record
Vinu Yamunan
Also filed as: YAMUNAN VINU
8 granted patents·1 pending application·118 citations·filing 2001–2007
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0188US6917098B1Three-level leadframe for no-lead packagesTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 12, 2005·65 cites·19 claims
- 0286US6869831B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 22, 2005·35 cites·12 claims
- 0376US7319275B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 15, 2008·5 cites·10 claims
- 0462US6977429B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 20, 2005·9 cites·7 claims
- 0561US7445960B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 4, 2008·1 cites·10 claims
- 0660US7276401B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 2, 2007·1 cites·10 claims
- 0760US7271494B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·1 cites·6 claims
- 0857US7323362B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 29, 2008·1 cites·4 claims
- 0935US2006051889A1Chip assembly reinforcementYAMUNAN VINU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →