Inventor · disambiguated record
Tohru Nakai
Also filed as: NAKAI TOHRU
14 granted patents·307 citations·filing 1999–2009
94Inventor score
Top patents by PatentIndex Score
14 records- 0197US7691189B2Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 2007·Granted Apr 6, 2010·57 cites·18 claims
- 0296US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 0394US8018045B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Sep 13, 2011·18 cites·23 claims
- 0493US8065794B2Printed wiring board and its manufacturing methodEN HONCHIN·Filed 2008·Granted Nov 29, 2011·26 cites·1 claims
- 0593US7535095B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted May 19, 2009·59 cites·13 claims
- 0691US8020291B2Method of manufacturing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Sep 20, 2011·13 cites·10 claims
- 0789US8006377B2Method for producing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·9 cites·13 claims
- 0887US8030577B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·9 cites·15 claims
- 0984US7230188B1Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 1999·Granted Jun 12, 2007·55 cites·16 claims
- 1082US7994433B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2009·Granted Aug 9, 2011·6 cites·8 claims
- 1176US8093507B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Jan 10, 2012·3 cites·19 claims
- 1275US8533943B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Sep 17, 2013·4 cites·7 claims
- 1369US7827680B2Electroplating process of electroplating an elecrically conductive sustrateIBIDEN CO LTD·Filed 2004·Granted Nov 9, 2010·11 cites·1 claims
- 1468US6797844B2Process for producing phthalaldehydeDAICEL CHEM·Filed 2001·Granted Sep 28, 2004·4 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →