Inventor · disambiguated record
Susumu Iwai
Also filed as: IWAI SUSUMU
12 granted patents·1,026 citations·filing 1989–2009
94Inventor score
Top patents by PatentIndex Score
12 records- 0197US5077601ACooling system for cooling an electronic device and heat radiation fin for use in the cooling systemHITACHI LTD·Filed 1989·Granted Dec 31, 1991·204 cites·7 claims
- 0296US5796580AAir-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channelsHITACHI LTD·Filed 1994·Granted Aug 18, 1998·237 cites·19 claims
- 0392US5646824AElectronic equipment and lap-top type electronic equipmentHITACHI LTD·Filed 1995·Granted Jul 8, 1997·155 cites·14 claims
- 0490US5428503AJet cooling apparatus for cooling electronic equipment and computer having the same mounted thereonHITACHI LTD·Filed 1994·Granted Jun 27, 1995·96 cites·11 claims
- 0590US5313362APackaging structure of small-sized computerHITACHI LTD·Filed 1992·Granted May 17, 1994·159 cites·8 claims
- 0682US5358032ALSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mountedHITACHI LTD·Filed 1993·Granted Oct 25, 1994·73 cites·10 claims
- 0775US7830502B2Substrate inspection device and substrate inspection methodHITACHI HIGH TECH CORP·Filed 2009·Granted Nov 9, 2010·4 cites·4 claims
- 0875US6185481B1Air cooled electronic equipment apparatusHITACHI LTD·Filed 1997·Granted Feb 6, 2001·42 cites·14 claims
- 0967US5805417AHeat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit boardHITACHI LTD·Filed 1996·Granted Sep 8, 1998·22 cites·14 claims
- 1056US6094343AHeat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive couplerHITACHI LTD·Filed 1998·Granted Jul 25, 2000·14 cites·16 claims
- 1146US6156427AElectroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the compositionHITACHI LTD·Filed 1991·Granted Dec 5, 2000·12 cites·16 claims
- 1245US6094344AHeat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation platesHITACHI LTD·Filed 1999·Granted Jul 25, 2000·8 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Susumu Iwai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →